Fully Automatic Precision Dicing Saw equipment for 8inch 12inch Wafer Cutting
The fully automatic precision dicing saw is an advanced semiconductor cutting system designed for high-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level cutting accuracy (±2μm) with minimal chipping (<5μm), outperforming alternative methods in semiconductor and advanced packaging applications. The system integrates high-rigidity spindles, nanometric positioning stages, and intelligent vision alignment for unmanned operation, meeting the stringent requirements of modern chip manufacturing and third-generation semiconductor processing.
Fully Automatic Precision Dicing Saw equipment
8inch 12inch
Wafer Cutting
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Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
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