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Laser Diode InP Indium Phosphide Wafer 100mm Diameter Black Color

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Laser Diode InP Indium Phosphide Wafer 100mm Diameter Black Color

Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color

Large Image :  Laser Diode InP Indium Phosphide Wafer 100mm Diameter Black Color

Product Details:
Place of Origin: CHINA
Brand Name: zmkj
Model Number: InP-3INCH
Payment & Shipping Terms:
Minimum Order Quantity: 10pcs
Price: by case
Packaging Details: single wafer case
Delivery Time: 3-4weeks
Supply Ability: 1000pcs/month

Laser Diode InP Indium Phosphide Wafer 100mm Diameter Black Color

Description
Materials: InP Single Crystal Industry: Semiconductor Substrates,device,
Color: Black Type: Semi- Type
Diameter: 100mm 4inch Thickness: 625um Or 350um
High Light:

Laser Diode Indium Phosphide Wafer

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InP Indium Phosphide Wafer

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Laser Diode inp wafer

4inch Semi-Insulating Indium Phosphide InP Wafer for LD Laser Diode,semiconductor wafer,3inch InP wafer,single crystal wafer​2inch 3inch 4inch InP substrates for LD application, semiconductor wafer,InP wafer,single crystal wafer

 

InP introduce                                                                                                          

InP single crystal
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 0

Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 1

 growth (modified Czochralski method) is used to pull a single 

crystal through a boric oxide liquid encapsulant starting from a seed.

The dopant (Fe, S, Sn or Zn)is added to the crucible along with the polycrystal. High pressure is applied inside the chamber to prevent decomposition of the Indium Phosphide.he company has developed a process to yield fully stoechiometric, high purity and low dislocation density inP single crystal.

The tCZ technique improves upon the LEC method thanks

to a thermal baffle technology in connection with a numerical

modeling of thermal growth conditions. tCZ is a cost-effective

mature technology with high quality reproducibility from boule to boule

 

Specification                                                                                                    

 

Fe Doped InP

Semi-Insulating InP Specifications

Growth Method VGF
Dopant Iron (FE)
Wafer Shape Round (DIA: 2", 3", AND 4")
Surface Orientation (100)±0.5°

*Other Orientations maybe available upon request

Resistivity (Ω.cm) ≥0.5 × 107
Mobility (cm2/V.S) ≥ 1,000
Etch Pitch Density (cm2) 1,500-5,000

 

Wafer Diameter (mm) 50.8±0.3 76.2±0.3 100±0.3
Thickness (µm) 350±25 625±25 625±25
TTV [P/P] (µm) ≤ 10 ≤ 10 ≤ 10
TTV [P/E] (µm) ≤ 10 ≤ 15 ≤ 15
WARP (µm) ≤ 15 ≤ 15 ≤ 15
OF (mm) 17±1 22±1 32.5±1
OF / IF (mm) 7±1 12±1 18±1
Polish* E/E, P/E, P/P E/E, P/E, P/P E/E, P/E, P/P

*E=Etched, P=Polished

Note: Other Specifications maybe available upon request

 

n- and p-type InP

Semi-conducting InP Specifications

Growth Method VGF
Dopant n-type: S, Sn AND Undoped; p-type: Zn
Wafer Shape Round (DIA: 2", 3", AND 4")
Surface Orientation (100)±0.5°

*Other Orientations maybe available upon request

Dopant S & Sn (n-type) Undoped (n-type) Zn (p-type)
Carrier Concentration (cm-3) (0.8-8) × 1018 (1-10) × 1015 (0.8-8) ×1018
Mobility (cm2/V.S.) (1-2.5) × 103 (3-5) × 103 50-100
Etch Pitch Density (cm2) 100-5,000 ≤ 5000 ≤ 500
Wafer Diameter (mm) 50.8±0.3 76.2±0.3 100±0.3
Thickness (µm) 350±25 625±25 625±25
TTV [P/P] (µm) ≤ 10 ≤ 10 ≤ 10
TTV [P/E] (µm) ≤ 10 ≤ 15 ≤ 15
WARP (µm) ≤ 15 ≤ 15 ≤ 15
OF (mm) 17±1 22±1 32.5±1
OF / IF (mm) 7±1 12±1 18±1
Polish* E/E, P/E, P/P E/E, P/E, P/P E/E, P/E, P/P

*E=Etched, P=Polished

Note: Other Specifications maybe available upon request

 

InP Wafer processing
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 0
Each ingot is cut into wafers which are lapped, polished and surface prepared for epitaxy. The overall process is detailed hereunder.

Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 3
Flat specification and identification The orientation is indicated on the wafers by two flats (long flat for orientation, small flat for identification). Usually the E.J. standard (European-Japanese) is used. The alternate flat configuration (U.S.) is mostly used for Ø 4" wafers.
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 3
Orientation of the boule Either exact (100) or misoriented wafers are offered.
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 3
Accuracy of the orientation of OF In response to the needs of the optoelectronic industry, we offers wafers with excellent accuracy of the OF orientation : < 0.02 degrees. This feature is an important benefit to customers making edge-emitting lasers and also to manufacturers who cleave to separate dies – allowing their designers to reduce the “real-estate” wasted in the streets.
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 3
Edge profile There are two common specs : chemical edge processing or mechanical edge processing (with an edge grinder).
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 3
Polishing Wafers are polished by means of a chemical-mechanical process resulting in a flat, damage-free surface. we provides both double-side polished and single-side polished (with lapped and etched back side) wafers.
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 3
Final surface preparation and packaging Wafers go through many chemical steps to remove the oxide produced during polishing and to create a clean surface with stable and uniform oxide layer that is ready for epitaxial growth - epiready surface and that reduces trace elements to extremely low levels . After final inspection, the wafers are packaged in a way that maintains the surface cleanliness.
Specific instructions for oxide removal are available for all types of epitaxial technologies (MOCVD, MBE).
Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 3
Database As part of our Statistical Process Control/Total Quality Management Program, extensive database recording the electrical and mechanical properties for every ingot as well as crystal quality and surface analysis of wafers are available. At each stage of fabrication, the product is inspected before passing to the next stage to maintain a high level of quality consistency from wafer to wafer and from boule to boule.

 

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Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 12

Package & delivery  

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Laser Diode InP  Indium Phosphide Wafer 100mm Diameter Black Color 14

FAQ:

Q: What's your MOQ and delivery time?

A: (1) For inventory, the MOQ is 5 pcs.

   (2) For customized products, the MOQ is 10-30 pcs up.

  (3) For customized products,the delivery time in 10days, custiomzed size for 2-3weeks 

Contact Details
SHANGHAI FAMOUS TRADE CO.,LTD

Contact Person: Wang

Tel: +8615801942596

Send your inquiry directly to us (0 / 3000)