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Home > Products > IC Silicon Wafer > Silicon Wafer 8 inch Diameter 200mm <111>Thickness 700um P Type N Type Single Polishing Double Polishing

Silicon Wafer 8 inch Diameter 200mm <111>Thickness 700um P Type N Type Single Polishing Double Polishing

Product Details

Place of Origin: china

Brand Name: zmkj

Model Number: si-8inch

Payment & Shipping Terms

Minimum Order Quantity: 25pcs

Price: by case

Packaging Details: 25pcs casstle in 100-grade cleaning room

Delivery Time: 5-30days

Get Best Price
Highlight:

silicon substrate

,

polished silicon wafer

Material:
Si Single Crystal
Industry:
IC Semicondctor Wafer,solor ,optical Glass
Application:
IC, Solor Wafer,optical Lens,
Size:
Dia200mm
Method:
Cz,Fz
Type:
Dopant: P(B), N(P)
Grade:
Prime Grade/test Grade
Material:
Si Single Crystal
Industry:
IC Semicondctor Wafer,solor ,optical Glass
Application:
IC, Solor Wafer,optical Lens,
Size:
Dia200mm
Method:
Cz,Fz
Type:
Dopant: P(B), N(P)
Grade:
Prime Grade/test Grade
Silicon Wafer 8 inch Diameter 200mm <111>Thickness 700um P Type N Type Single Polishing Double Polishing

Product Description

Silicon Wafer 8 inch Diameter 200mm Thickness 700um P Type N Type Single Polishing Double Polishing

Silicon wafers are typically cut from high-purity monocrystalline silicon rods. High-purity monocrystalline silicon rods are prepared by Czochralski process or float zone process, and then cut and polished to make silicon wafers. Common silicon wafer diameters include 3 inches, 4 inches, 6 inches, 8 inches, 12 inches, etc. Wafer thickness is generally between 0.5-0.7 mm. Silicon wafers can be doped with different impurity elements (e.g., phosphorus, boron) to adjust their electrical properties to create n-type or p-type silicon materials. This is important for the manufacture of various integrated circuits and semiconductor devices. The surface of silicon wafers needs to be polished, cleaned and other treatments to remove surface defects and contamination and ensure that the surface of the wafer is flat and smooth.

Silicon Wafer 8 inch Diameter 200mm <111>Thickness 700um P Type N Type Single Polishing Double Polishing 0


Features

1. Crystal structure: Silicon is a typical elemental semiconductor with a regular diamond crystal structure and an orderly arrangement of atoms, which provides a good basis for its electronic properties.
2. Electronic characteristics: The bandgap width of silicon is about 1.12 eV, which is between the insulator and the conductor, and can generate and recombine electron-hole pairs under the action of an external electric field, thus exhibiting good semiconductor properties.
3. Doping: Silicon can be adjusted by incorporating group III (e.g., B) or V (e.g., P, As) impurity elements to adjust its conductivity type and resistivity, providing the possibility of fabricating various semiconductor devices.
4. Oxidability: Silicon can chemically react with oxygen at high temperatures to form a dense and uniform silicon dioxide (SiO2) film, which lays the foundation for silicon-based integrated circuit processes.
5. Mechanical properties: Silicon has high hardness, strength and chemical stability, which is conducive to subsequent cutting, polishing and other processing processes.
6. Size and size: Wafers can be prepared into discs ranging from 2 inches to 12 inches in diameter to meet the needs of different processes.

Silicon Wafer 8 inch Diameter 200mm <111>Thickness 700um P Type N Type Single Polishing Double Polishing 1


Technical Parameters

Silicon Wafer 8 inch Diameter 200mm <111>Thickness 700um P Type N Type Single Polishing Double Polishing 2


Applications

1. Integrated circuits: Silicon wafers are the core carriers for the manufacture of various digital integrated circuits (such as CPUs, memories) and analog integrated circuits (such as operational amplifiers and sensors).
2. Solar cells: Silicon wafers are made into solar cell modules, which are widely used in distributed photovoltaic power generation and power supply.
3. Microelectromechanical systems (MEMS): MEMS devices such as microactuators and sensors are fabricated using the mechanical properties and microfabrication techniques of silicon materials.
3. Power electronics: Fabricate a wide range of power semiconductor devices using silicon-based high temperature tolerance and high power carrying capacity.
4. Sensors: Silicon-based sensors are widely used in electronic equipment, industrial control, automotive electronics and other fields, such as pressure sensors, acceleration sensors, etc.

Silicon Wafer 8 inch Diameter 200mm <111>Thickness 700um P Type N Type Single Polishing Double Polishing 3


Our services

1. Factory direct manufacture and sell.

2. Fast, accurate quotes.

3. Reply to you within 24 working hours.

4. ODM: Customized design is avaliable.

5. Speed and precious delivery.


FAQ

1. Q: What's the delivery time?
A: (1) For the standard products
For inventory: the delivery is 5 workdays after you place the order.
For customized products: the delivery is 2 or 3 weeks after you place the order.
(2) For the special-shaped products, the delivery is 4 workweeks after you place the order.

2. Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications for your optical components
based on your needs.