Product Details
Place of Origin: CHINA
Brand Name: zmkj
Model Number: AlN
Payment & Shipping Terms
Minimum Order Quantity: 20pcs
Price: by case
Packaging Details: 25pcs cassette box
Delivery Time: 10-20days
Supply Ability: 10000pcs
Material: |
SiC Ceramic Substrates |
Applications: |
Ceramic Plates For Semiconductor Processing |
Color: |
Black |
Size: |
Customized Size |
Purity: |
98% |
Material: |
SiC Ceramic Substrates |
Applications: |
Ceramic Plates For Semiconductor Processing |
Color: |
Black |
Size: |
Customized Size |
Purity: |
98% |
Silicon Carbide Ceramic Substrate,SIC ceramic parts, customized polishing silicon carbide ceramic bearing ring
1. Introduction:
1. SIC Cermaic has the advantages of super hardness, high wear-resisting,
good corrosion resistance and electric insulation,resistant acid-base,high intensity,thermostable,high temperature tolerance,good insulation,high strength,precision process,high mechanical strength,good chemical stability.
Good smoothness, mechanical seal good, polishing surface and so on.
2. Forming methods includes:
Drying pressing
Isostatic pressing
Hot pressing casting
3. The application of our product:
Ceramic shaft,sleeve for different pump.
Ceramic plunger for high pressure cleaner.
Wearlessness,resistant acid-base and high intensity ceramic assembly
apply to petroleum,chemical industry.
Wearlesness,corrosion resistance,thermos table parts apply to precision machine.
| Item | SSIC |
| SIC Purity(%) | >98 |
| Bulk Density(g/cm3 ) | 3.06-3.15 |
| Max. Service Temp.(℃) | 1800 |
| Compressive strength (Mpa) | ≥3900 |
| Bending strength(MPa) | 400-580 |
| Fracture strength(MPa) | 3.05-4.6 |
| Young's modulus(Gpa) | 380-410 |
| Thermal conductivity W/MK | 102.6 |
| Thermal expansion a(1/℃) | 4.02x10 |
| Poisson's ratio | 0.14 |
| Apparent porosity % | 0 |
| Diameter (mm) | Thickness (mm) | ||||
|
2'' (50.8mm ) OF 16mm |
3'' (76.2mm) OF22mm |
4'' (100mm) OF 30mm |
5“ (125mm) OF 42.5mm |
6" (150mm) OF 47.5mm |
0.385 |
| 0.5 | |||||
| 0.65 | |||||
| 1.0 | |||||
Polishing Service
Our product can be polished(single and double polish) by the advanced machine which imported
from abroad. Ceramic substrate surface roughness can reach to 1nm without porous after being polished.
It is perfectly suitable for the device application of small spec, high precision , wiring density and good stability.
