0.3mm DSP Sapphire Wafer Substrate Customized Thickness

The Kyropoulos process (KY process) for sapphire crystal growth is currently used by many companies in China to produce sapphire for the electronics and optics industries.

High-purity, aluminum oxide is melted in a crucible at over 2100 degrees Celsius. Typically the crucible is made of tungsten or molybdenum. A precisely oriented seed crystal is dipped into the molten alumina. The seed crystal is slowly pulled upwards and may be rotated simultaneously. By precisely controlling the temperature gradients, rate of pulling and rate of temperature decrease, it is possible to produce a large, single-crystal, roughly cylindrical ingot from the melt.

After single crystal sapphire boules are grown, they are core-drilled into cylindrical rods, The rods are sliced up into the desired window thickness and finally polished to the desired surface finish.

Sapphire Windows are manufactured from single crystal sapphire, making them ideal for demanding applications (such as laser systems) because of their extreme surface hardness, high thermal conductivity, high dielectric constant and resistance to common chemical acids and alkalis. Sapphire is the second hardest crystal next to diamonds and, because of their structural strength, sapphire windows can be made much thinner than other common dielectric windows with improved transmittance. Chemically, sapphire is single crystal aluminum oxide (Al2O3), and is useful in a transmission range from 0.2 - 5.5µm.
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We can supply professional customized service in time and provide cooperation and support of new product development and technology appliance.

Applications
Sapphire Washers, Sapphire Windows, Sapphire Bearings, Sapphire Rods, Sapphire Tubes, Ruby
sapphire wafer, dome sapphire, Sapphire insulation Film, Sapphire ball lens, Sapphire/ruby ball

 

Material: Single crystal Al2O3 99.999％

Orientation: 4°off C-plane(0001) to M -axis±0.1°,

OF Orientation flat: A axis±0.1° 

Frontside Surface Roughness:Ra＜0.3nm

Backside Surface Roughness: 0.8~1.2um

( Or double side polished,  both side Ra＜0.3nm)

TTV:＜15um

BOW:-15~0um 

WARP:＜15um

Laser Mark Series No. by needs

Package:Vacuum-sealed containers with nitrogen backfill in a class 100 environment