12inch Sapphire wafer sapphire substrate Al2O3 wafer 9.0Mohs transparent SSP DSP C-axis

Sapphire Substrate, Sapphire Wafer, Sapphire Singal Crystal Wafer, Al2O3 wafer, High-Purity Al2O3 substrate, High-Hardness wafer, High-Performance Sapphire wafer, Al2O3 Single Crystal Wafer

Features of Sapphire Wafer

· Crafted from synthetic sapphire with an aluminium oxide (Al₂O₃) purity of 99.999%.

· Boasts a Mohs hardness rating of 9.0, ensuring superior scratch resistance and durability.

· Offers 85% visible light transmissivity, providing exceptional clarity and visibility.

· Supports customization based on provided design drawings.

· Delivers high performance, even in challenging and harsh environments.

*This is the high thickness sapphire wafer (12inch)

About 12inch Sapphire Wafer

Manufacturing 12-inch wafers is more difficult due to challenges in crystal growth, cutting, polishing, equipment limitations, yield issues, and quality control.

This complexity makes 12-inch wafers less common and more expensive compared to 4-inch, 6-inch, and 8-inch wafers.

Here are 4 points about why they are the most difficult ones.

1. Crystal Growth: It is very hard to maintain the uniformity of so large crystal while the small fluctuations in temperature and chemical composition can impact the quality.

Besides, larger crystals have a higher likelihood of internal defects such as dislocations and stress concentrations, which are harder to manage.

2. Processing Challenges: Cutting and grinding larger wafers require higher precision equipment and techniques. Any minor errors are magnified, leading to a higher defect rate.

Also, Polishing larger wafers takes more time and precision to ensure surface smoothness and consistent thickness.

3. Equipment and Cost: Manufacturing 12-inch wafers necessitates larger, more sophisticated equipment, leading to higher initial investment and maintenance costs.

In addition, Due to the increased difficulty and higher defect rates, the production cost for 12-inch wafers is significantly higher than for 8-inch and 6-inch wafers.

4. Thermal Treatment and Stress: Larger wafers are more prone to stress during thermal treatment, which can cause warping or cracking.

Furthermore, maintaining temperature uniformity during thermal processes is more challenging for larger wafers, affecting the final quality.

To sum up, the 12-inch sapphire wafers are the hardest ones to manufacture.