logo
Products
Products
Home > Products > Sapphire Wafer > Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0

Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0

Product Details

Place of Origin: China

Brand Name: zmsh

Certification: rohs

Model Number: 8'' Dia 200mm±0.2mm Thickness 725Um

Payment & Shipping Terms

Minimum Order Quantity: 5

Price: 45

Packaging Details: Foam Cushion Carrier Box + Carton box

Delivery Time: 3-5weeks

Payment Terms: Western Union, T/T

Supply Ability: 3000per month

Get Best Price
Highlight:

Sapphire Wafer 8''

,

725Um Thickness Sapphire Wafer

Material:
>99.99% Sapphire Crystal
Diameter:
200mm±0.2mm
Thickness:
725±25um
Orientation:
C-Plane <0001>
TTV:
≤15um
WRAP:
≤30um
BOW:
-30~10um
Material:
>99.99% Sapphire Crystal
Diameter:
200mm±0.2mm
Thickness:
725±25um
Orientation:
C-Plane <0001>
TTV:
≤15um
WRAP:
≤30um
BOW:
-30~10um
Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0

 

8" Sapphire Wafer 200mm Diameter (±0.2mm), 725µm Thickness, C-Plane SSP,DSP

 

 

This high-purity 8-inch (200mm) sapphire wafer features exceptional dimensional precision (±0.2mm diameter, 725µm thickness) and crystallographic orientation (C-plane), making it ideal for demanding optoelectronic and semiconductor applications. With 99.99% purity and superior mechanical/thermal stability, the wafer serves as an optimal substrate for LED, laser diode, and RF device fabrication. Its uniform surface finish and chemical inertness ensure reliability in harsh environments, while its large diameter supports cost-effective mass production.

 


 

Key Features of Sapphire Wafers

 

Sapphire Wafer's Precision Geometry:

  • Diameter: 200mm ±0.2mm, ensuring compatibility with standard semiconductor tools.
  • Thickness: 725µm ±25µm, optimized for mechanical strength and process stability.

 

 

Sapphire Wafer's Ultra-High Purity:

  • >99.99% (4N) purity, minimizing impurities that affect optical/electrical performance.

 

 

Sapphire Wafer's Robust Material Properties:

  • Hardness: 9 Mohs, scratch-resistant for handling durability.
  • Thermal Stability: Melting point ~2,050°C, suitable for high-temperature processes.
  • Optical Transparency: 85%+ in visible to near-IR spectra (350nm–4,500nm).

 

 

Sapphire Wafer's Surface Quality:

  • Epitaxy-ready polish: Ra <0.3nm for defect-free thin-film deposition.
  • Optional double-side polishing upon request.

 

 

Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 0

 


 

Applications of Sapphire Wafers images

 

Sapphire wafer in Optoelectronics:

Substrate for blue/green/white LEDs (InGaN/GaN epitaxy).

Laser diodes (edge-emitting/VCSELs) in displays and communications.

 

Sapphire wafer in Power Electronics:

RF devices (5G/6G antennas, power amplifiers) due to low dielectric loss.

High-electron-mobility transistors (HEMTs) for electric vehicles.

 

Sapphire wafer in Industrial & Defense:

IR windows, missile domes (sapphire’s transparency to mid-IR).

Protective covers for sensors in corrosive/abrasive environments.

 

Sapphire wafer in Emerging Technologies:

Quantum computing (SPD crystal substrates).

Wearable device screens (scratch-resistant covers).

 

Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 1Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 2

 


 

Specifications

 

Parameter

Value

Diameter 200mm ±0.2mm
Thickness 725µm ±25µm
Orientation C-plane (0001) ±0.2°
Purity >99.99% (4N)
Surface Roughness (Ra) <0.3nm (epi-ready)
TTV ≤15um
WARP ≤30um
BOW -30~10um

 

 


 

Factory Equipments

 

 Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 3Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 4Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 5Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 6Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 7Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 8Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 9Sapphire Wafer 8'' Dia 200mm±0.2mm Thickness 725Um C-Plane SSP,DSP hardness9.0 10