4Inch Quartz Wafer Diameter 100mm Fused Silica Wafer for Semiconductor Manufacturing
The 4-inch quartz wafer (100mm) is a large-format, ultra-high-purity fused silica substrate designed for high-precision, high-stability applications in semiconductors, optoelectronics, and advanced optics. Compared to 3-inch wafers, the 4-inch specification offers significantly greater usable area, improving production efficiency—particularly for batch manufacturing of IC photomasks, high-power laser optics, and MEMS sensors.
ZMSH specializes in the R&D and production of 4-inch and larger quartz wafers, offering:
- Full-size customization: Supports 4-inch, 6-inch, and 8-inch wafers, with non-standard sizes (e.g., square, sector-shaped) available.
- High-precision processing: Includes double-side ultra-polishing (Ra≤0.5nm), laser dicing (±0.01mm tolerance), and micro-hole/special-shaped via drilling.
- Functional treatments: Anti-reflective (AR) coatings, IR anti-reflection, diamond-like carbon (DLC) coatings, and more.
- Industry-grade solutions: Semiconductor-level cleanliness (Class 10), low defect density (≤0.1/cm²), ideal for EUV lithography and quantum computing.
Specification for 4inch quartz wafer
| Technical Term |
Specification |
| Diameter |
4 inch (100mm) |
| Thickness Range |
0.5mm~1.5mm |
| Surface Roughness (Polished) |
≤0.5nm |
| Transmittance @193nm |
>93% |
| CTE (20-300°C) |
0.55×10⁻⁶/°C |
| Parallelism |
≤3μm |
| Vacuum Compatibility |
10⁻¹⁰ Torr |
Key Characteristics of 4inch quartz wafer
1. Large-size precision: TTV≤10μm at 100mm diameter ensures process uniformity.
2. Ultra-low CTE: 0.55×10⁻⁶/°C, suitable for high-temperature processes (e.g., annealing, ion implantation).
3. Broadband transparency: >93% transmittance @193nm (DUV), >90% @3-5μm (IR).
4. Superior surface quality: Double-side polished with Ra≤0.5nm for nanoscale lithography.
5. Enhanced durability: Optional chemical strengthening boosts flexural strength to 600MPa; plasma-resistant.
Strategic Applications of 4inch quartz wafer
| Field |
Applications |
| Semiconductor |
EUV lithography optics, photomask substrates, 3D NAND interposers |
| High-power Lasers |
Laser mirrors, pulse compression gratings, fiber laser endcaps |
| Quantum Technology |
Qubit chip carriers, cold atom trap viewports, single-photon detector substrates |
| Aerospace |
Satellite lenses, radiation-resistant sensor windows, particle detectors |
| Biomedical |
DNA sequencing chips, endoscope optics, microfluidic device molds |
Customization Services
ZMSH provides end-to-end customization for 4-inch quartz wafers, including:
- Material selection: JGS1/JGS2 UV-grade or IR-grade fused silica.
- Precision machining: Nanoscale polishing (λ/20), laser microstructuring (±1μm accuracy).
- Functional coatings: AR (193-1064nm), high-LIDT laser coatings (>5J/cm²).
- QA support: Full inspection reports (AOI, interferometry).
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