4inch Quartz Wafer Custom Thickness Range 0.5 mm to 1.5 mm Ra ≤ 0.5 nm
ZMSH specializes in precision-manufactured 4-inch quartz wafers, catering to high-performance optoelectronic, semiconductor, and MEMS applications. Unlike smaller formats, 4-inch quartz wafers provide extended surface area for multi-layer integration, enabling scalable production of advanced devices. Key features include:
1. Material: High-purity fused silica (SiO₂) with <50 ppm hydroxyl (OH⁻) content and <0.1 ppm metallic impurities, ensuring ultra-low optical loss .
2. Dimensions: Custom diameters (100.00 mm ±0.25 mm) and thicknesses (0.525–1.200 mm, TTV ≤10 μm) .
3. Shapes: Circular, square, or irregular geometries with non-standard apertures, stepped edges, or gradient thickness.
4. Surface Finish: Ultra-smooth surfaces (Ra ≤1.0 nm) for minimal light scattering .
Specification for 4inch quartz wafer
| Parameter |
Specification |
| Diameter |
100.00 mm ±0.25 mm |
| Thickness Range |
0.525–1.200 mm |
| Total Thickness Variation (TTV) |
≤10 μm (300 mm diameter)
4
|
| Surface Roughness (Ra) |
≤1.0 nm |
| Ultraviolet Transmittance |
>92% @185–3500 nm
1
|
| Thermal Expansion Coefficient (CTE) |
0.55×10⁻⁶/°C (20–300°C)
1
|
| Resistivity (350°C) |
>7×10⁷ Ω·cm |
Key Characteristics of 4inch quartz wafer
1. Optical Superiority
Broad Spectral Transmission: >92% transmittance from 185 nm (UV) to 3500 nm (IR), ideal for UV lithography and quantum sensing .
Low Thermal Expansion: CTE of 0.55×10⁻⁶/°C (20–300°C), maintaining dimensional stability up to 1100°C .
2. Mechanical & Chemical Resilience
High Hardness: Mohs scale 7, resistant to abrasion and mechanical shock .
Acid Resistance: 30× higher durability than ceramics, suitable for aggressive chemical environments .
3. Electrical Performance
Insulation: Resistivity >7×10⁷ Ω·cm (350°C), minimizing parasitic capacitance in high-frequency circuits .
SAW Compatibility: Optimized for Surface Acoustic Wave (SAW) filters with precise cutting angles (e.g., 34.33° for FC-cut) .
Strategic Applications of 4inch quartz wafer
1. Advanced MEMS Devices
Pressure sensors, gyroscopes, and inkjet printheads leveraging 4-inch wafers for multi-layer integration and thermal stability .
2. Optoelectronic Systems
UV laser diodes, fiber-optic collimators, and LiDAR components requiring low-loss optical paths .
3. Semiconductor Packaging
Wafer-level packaging (WLP) substrates for CMOS image sensors and RFICs, supporting TSV (Through-Silicon Via) technology .
4. Quantum Technologies
Substrates for diamond nitrogen-vacancy (NV) centers and superconducting qubits, benefiting from ultra-low defect density .
Company Customization Services
We offer full-scale customization for 4-inch quartz wafers, including:
1. Precision Machining: CNC diamond turning for <1 μm dimensional accuracy.
2. Surface Treatments: AR coatings (<0.5% reflection), hydrophobic films (water contact angle >150°).
3. Rapid Prototyping: 5–7 days for samples, supporting hybrid geometries (e.g., through-holes + notches).
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