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High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance

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High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance

High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance
High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance

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Product Details:
Place of Origin: CHINA
Brand Name: ZMSH
Certification: rohs
Model Number: SiC Ceramic Substrate
Payment & Shipping Terms:
Minimum Order Quantity: 25
Price: by case
Packaging Details: package in 100-grade cleaning room
Delivery Time: 2-4weeks
Payment Terms: T/T
Detailed Product Description
Size/Shape: Customized Thermal Conductivity: 120-270 W/(m·K)
Flexural Strength: 300-500 MPa Insulation Resistance: >10¹⁴ Ω·cm
Thickness: 0.25-3 Mm Polishing: Ra <0.1 μm
Highlight:

SiC ceramic insulating substrate

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high-temperature resistant ceramic substrate

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high-purity SiC substrate

SiC Ceramic Substrates Overview

 

 

High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance

 

 

 

Silicon Carbide (SiC) ceramic substrates are advanced ceramic materials manufactured through high-temperature sintering of high-purity SiC powder, exhibiting exceptional thermal conductivity, high mechanical strength, and outstanding chemical stability. As a key third-generation semiconductor material, SiC ceramic substrates are widely used in high-power electronics, RF devices, LED packaging, and high-temperature sensors. Their unique combination of properties—including high thermal conductivity, low thermal expansion coefficient, and extreme hardness—makes them ideal for electronic packaging and thermal management solutions in harsh environments. Compared to traditional alumina (Al₂O₃) or aluminum nitride (AlN) substrates, SiC ceramic substrates demonstrate superior performance in high-temperature, high-frequency, and high-power applications, particularly in electric vehicles, 5G communications, and aerospace systems.

 

 

 


 

SiC Ceramic Substrates Key Characteristics

 

Property Category

 

Specifications/Performance

 

Technical Advantages

 

Thermal Properties

 

Thermal conductivity: 120-270 W/(m·K) (exceeds copper)
CTE: 4.0×10⁻⁶/°C (matches silicon chips)

 

Enhanced heat dissipation, reduced thermal stress, improved device reliability

Mechanical Properties

 

Flexural strength: 300-500 MPa
Mohs hardness: 9.5 (second only to diamond)

 

Wear/impact resistance, suitable for high-stress environments

 

Electrical Properties

 

Insulation resistance: >10¹⁴ Ω·cm
Dielectric constant: 9.7-10.2

 

Low signal loss, ideal for high-frequency circuits

 

Chemical Stability

 

Resists acid/alkali corrosion and oxidation (stable up to 1600°C)

 

Reliable performance in chemical/space harsh conditions

 

Dimensions & Customization

 

Thickness: 0.25-3 mm
Max. size: 8-inch wafer format

 

Flexible solutions for diverse packaging needs

 

Surface Treatment

 

Polishing: Ra <0.1 μm
Metallization (Au/Ag/Cu plating)

 

Optimized soldering and chip attachment performance

 

 

 


 

SiC Ceramic Substrates Primary Applications

High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance 0

 

1. Power Electronics

  • EV inverters: SiC ceramic substrates serve as IGBT module heat spreaders, reducing chip operating temperatures by 20-30% and boosting energy conversion efficiency.
  • Fast-charging modules: SiC ceramic substrates enable 800V high-voltage platforms in charging piles, cutting charging time while enhancing reliability.
  • Industrial VFDs: Replace AlN substrates to address thermal challenges in high-power-density systems.

 

2. RF Communications

  • 5G base station PAs: SiC ceramic substrates' low dielectric loss ensures signal integrity in millimeter-wave bands, reducing energy consumption by 15%.
  • Radar systems: SiC ceramic substrates used in phased-array T/R modules for military applications with high-frequency/high-temperature demands.

 

3. Optoelectronics

  • High-brightness LED packaging: COB (Chip-on-Board) substrates mitigate lumen decay and improve brightness uniformity.
  • Micro-LED displays: Address thermal accumulation in high-pixel-density microdisplays.

High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance 1

4. Aerospace

  • Engine sensors: SiC ceramic substrates withstand 1000°C+ exhaust gases for real-time engine monitoring.
  • Satellite power control: Maintain stable performance under cosmic radiation and extreme thermal cycling (-150°C to +200°C).

 

5. High-Temperature Industrial

  • Semiconductor heating plates: SiC ceramic substrates provide contamination-free uniform heating in MOCVD reactors.
  • Chemical reactor linings: SiC ceramic substrates resist concentrated acids/alkalis, extending service life 3-5x versus metals.

 

6. Defense

  • Armor composites: Lightweight (30% lighter than steel) yet ultra-hard for vehicle protection.
  • Missile radomes: Exceptional wave transparency survives Mach 5+ aerodynamic heating.

 

 


 

 

1. Q: What are the advantages of SiC ceramic substrates over traditional materials like AlN or Al₂O₃?
    A: SiC ceramic substrates offer 3-5x higher thermal conductivity (up to 270 W/mK), superior mechanical strength (450 MPa vs. 300 MPa of AlN), and extreme temperature resistance (1600°C), making them ideal for high-power applications.

 

 

2. Q: Why is SiC ceramic used in electric vehicle power modules?
    A: Its ultra-high thermal conductivity reduces IGBT chip temperatures by 20-30%, significantly improving EV inverter efficiency and charging speed while extending component lifespan.

 

 


Tag: #High-Purity SiC Ceramic, #Customized, # SiC Ceramic Insulating Substrate, #High-Temperature Resistance

  

 

 

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Tel: +8615801942596

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