Product Details:
Payment & Shipping Terms:
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Size/Shape: | Customized | Thermal Conductivity: | 120-270 W/(m·K) |
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Flexural Strength: | 300-500 MPa | Insulation Resistance: | >10¹⁴ Ω·cm |
Thickness: | 0.25-3 Mm | Polishing: | Ra <0.1 μm |
Highlight: | SiC ceramic insulating substrate,high-temperature resistant ceramic substrate,high-purity SiC substrate |
High-Purity SiC Ceramic Insulating Substrate High-Temperature Resistance
Silicon Carbide (SiC) ceramic substrates are advanced ceramic materials manufactured through high-temperature sintering of high-purity SiC powder, exhibiting exceptional thermal conductivity, high mechanical strength, and outstanding chemical stability. As a key third-generation semiconductor material, SiC ceramic substrates are widely used in high-power electronics, RF devices, LED packaging, and high-temperature sensors. Their unique combination of properties—including high thermal conductivity, low thermal expansion coefficient, and extreme hardness—makes them ideal for electronic packaging and thermal management solutions in harsh environments. Compared to traditional alumina (Al₂O₃) or aluminum nitride (AlN) substrates, SiC ceramic substrates demonstrate superior performance in high-temperature, high-frequency, and high-power applications, particularly in electric vehicles, 5G communications, and aerospace systems.
Property Category
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Specifications/Performance
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Technical Advantages
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Thermal Properties
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Thermal conductivity: 120-270 W/(m·K) (exceeds copper)
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Enhanced heat dissipation, reduced thermal stress, improved device reliability |
Mechanical Properties
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Flexural strength: 300-500 MPa
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Wear/impact resistance, suitable for high-stress environments
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Electrical Properties
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Insulation resistance: >10¹⁴ Ω·cm
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Low signal loss, ideal for high-frequency circuits
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Chemical Stability
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Resists acid/alkali corrosion and oxidation (stable up to 1600°C)
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Reliable performance in chemical/space harsh conditions
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Dimensions & Customization
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Thickness: 0.25-3 mm
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Flexible solutions for diverse packaging needs
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Surface Treatment
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Polishing: Ra <0.1 μm
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Optimized soldering and chip attachment performance
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1. Power Electronics
2. RF Communications
3. Optoelectronics
4. Aerospace
5. High-Temperature Industrial
6. Defense
2. SiC Ball , SiC Marbels Dia 0.5mm~50mm Customizable , High-precision Bearing Ball
1. Q: What are the advantages of SiC ceramic substrates over traditional materials like AlN or Al₂O₃?
A: SiC ceramic substrates offer 3-5x higher thermal conductivity (up to 270 W/mK), superior mechanical strength (450 MPa vs. 300 MPa of AlN), and extreme temperature resistance (1600°C), making them ideal for high-power applications.
2. Q: Why is SiC ceramic used in electric vehicle power modules?
A: Its ultra-high thermal conductivity reduces IGBT chip temperatures by 20-30%, significantly improving EV inverter efficiency and charging speed while extending component lifespan.
Tag: #High-Purity SiC Ceramic, #Customized, # SiC Ceramic Insulating Substrate, #High-Temperature Resistance
Contact Person: Mr. Wang
Tel: +8615801942596