​​Multi-Wire Saw Machine for Cutting Silicon/Sapphire Ingots/Quartz​​ Semiconductor Materials

​​Multi-Wire Saw Machine for Cutting Silicon/Sapphire Ingots/Quartz​​ semiconductor materials

The multi-wire saw is a versatile and technologically advanced cutting equipment. This specific model is meticulously designed to meet the squaring and multi-wire slicing requirements of hard and brittle materials such as sapphire ingots and quartz. It boasts exceptional flexibility and multifunctionality, capable of performing both ​​single-wire squaring​​ (for specialized scenarios demanding high cutting precision) and ​​multi-wire squaring/slicing​​, significantly enhancing production efficiency—truly a ​​multi-purpose machine.

Its broad application scope extends beyond sapphire ingots and quartz to include ​​semiconductor materials, monocrystalline silicon, polycrystalline silicon ingots, and various gemstones​​ (e.g., for squaring and slicing). During cutting, the equipment demonstrates outstanding performance, equipped with a ​​precision temperature control system​​ that precisely regulates cutting temperatures to prevent adverse effects of thermal fluctuations on cutting accuracy and material quality. Additionally, it is ​​environmentally friendly and highly efficient​​, delivering ​​high-precision slicing with minimal warpage​​ and stable, reliable slice quality. Compared to traditional cutting equipment, it reduces cutting costs while maintaining quality, delivering superior economic benefits for enterprises.

Multi-Wire Saw Machine Operating Principle

The multi-wire saw operates on the principle of ​​high-speed diamond wire carrying abrasives to grind-cut materials​​. The detailed process is as follows:

​​1. Wire Mesh Formation​​

• The diamond wire is unwound from the ​​pay-off reel​​, guided through a precisely arranged series of ​​guide wheels​​, and finally taken up by the ​​take-up reel​​, forming a stable and tightly packed diamond wire mesh in the cutting zone. The pay-off and take-up reels are driven by motors with precise control to ensure the diamond wire moves ​​continuously and at a constant speed​​, providing a stable foundation for cutting. The guide wheels precisely direct the wire’s path, ensuring the mesh is neatly aligned for stable and accurate cutting.

​​2. Workpiece Feeding and Cutting​​

• The workpiece (e.g., sapphire ingots, monocrystalline silicon) is fed into the cutting zone along a ​​pre-set path and feed rate​​ by servo-driven mechanisms, gradually approaching the high-speed moving diamond wire mesh. When the workpiece contacts the wire, the abrasive-laden wire grinds and cuts it into thin slices or specific shapes. High-precision servo motors control the feeding motion, ensuring cutting accuracy and precision.

​​3. Tension Control​​

• Tension in the cutting wire is critical. A ​​tension control system​​ (comprising tension sensors, controllers, and actuators) monitors and adjusts the wire’s tension in real time, maintaining it within an optimal range. Tension sensors detect wire tension and relay signals to the controller, which adjusts it via actuators (e.g., cylinders, motors) to keep the tension constant. Stable tension prevents wire breakage from excessive force or accuracy loss from insufficient tension, ensuring stable and efficient cutting.

​​4. Cooling and Lubrication​​

• Cutting generates significant heat, which can deform the workpiece or accelerate wire wear. A ​​coolant​​ is sprayed onto the cutting zone via a nozzle system to dissipate heat, lowering temperatures of both the workpiece and wire. The coolant also lubricates the cutting interface, reducing friction, improving efficiency, and enhancing slice quality.

Multi-Wire Saw Machine Characteristic

Multi-Wire Saw Machine Primary Applications

1. Q: ​​What materials can a multi-wire saw cut?​​

    ​​A:​​ Multi-wire saws efficiently cut hard, brittle materials like ​​silicon wafers, sapphire, quartz, ceramics, and gemstones​​ with high precision.

2. Q: ​​Why is a multi-wire saw better than traditional cutting methods?​​

​​    A:​​ It achieves ​​faster cutting speeds, thinner slices, and lower material waste​​ due to its high-speed wire (up to 1000m/min) and multi-blade cutting design.

Tags: #​​Multi-Wire Saw Machine, #Custom, #Cutting Silicon/Sapphire Ingots/Quartz, #Semiconductor Materials