CMP Grinding Plate Chemical Mechanical Polishing of Wafers
CMP Grinding Plates are core consumables in the Chemical Mechanical Polishing (CMP) process. They are primarily used to condition and activate the polishing pad surface, maintaining a stable polishing rate, achieving wafer-scale nanoscale planarization, and directly impacting the yield, cost, and productivity of semiconductor manufacturing.
CMP Grinding Plates interact with the polishing pad surface through mechanical conditioning, removing polishing by-products and glazed layers, restoring the pad's roughness and porosity. This ensures uniform distribution of polishing slurry and a consistent Material Removal Rate (MRR). They are indispensable key components in advanced semiconductor processes (e.g., copper interconnects, silicon vias, STI) .
CMP Grinding Plate Core Functions
1.Conditioning Polishing Pad Surface: Removes glazed layers and clogging materials from the pad surface, restoring its roughness and open-cell structure to maintain a stable polishing rate.
2.Controlling Polishing Uniformity: Ensures consistent morphology of the pad surface through precise conditioning actions, preventing non-uniform polishing (e.g., dishing, erosion) on the wafer surface.
3.Extending Polishing Pad Life: Regular conditioning reduces the frequency of pad replacement, lowering production costs.
4.Reducing Defects: Optimizing conditioning parameters (e.g., pressure, rotational speed) minimizes the risk of scratches, particle contamination, and metal residue on the wafer surface.
CMP Grinding Plate Technical Features
| Feature Category |
Specific Characteristics |
Value Proposition |
| Material Innovation |
Employs CVD diamond coatings, sintered abrasive technology (e.g., 3M Trizact™ series), or ceramic composites (e.g., high-purity alumina)
|
Achieves ultra-high hardness (Mohs 9+), high wear resistance, and long service life |
| Structural Design |
Micro-replicated surface textures (e.g., 3M Trizact™), precise diamond placement (e.g., C-series), porous structures, or custom geometries (e.g., bar, disc)
|
Provides consistent conditioning performance, excellent slurry distribution, and lower defect rates |
| Performance Advantages |
Metal-free contamination (coatings can reduce metal leaching by 75%), low coefficient of thermal expansion, high chemical stability, and adjustable stiffness
|
Meets advanced node stringent requirements for purity, thermal stability, and process consistency |
| Customization Capability |
Supports diameter customization (e.g., 95mm to 600mm), diamond grit selection (e.g., 74μm to 251μm), and base material adaptation (stainless steel, ceramic polymer)
|
Adapts to different CMP equipment (rotary, orbital) and process needs (Cu, W, Si polishing) |
CMP Grinding Plate Types and Applications
1.Diamond Conditioning Disks:
- Features: Use CVD diamond or electroplated diamond as abrasives, fixed to a stainless steel or ceramic base via sintering, offering extremely high conditioning efficiency and service life.
- Application: Primarily used in CMP processes for high-end logic and memory chip manufacturing, such as copper barrier layers (Barrier Cu) and Shallow Trench Isolation (STI).
2.Metal-Free Conditioning Brushes:
- Features: Use polymer or ceramic fiber bristles, are metal-free, avoid ionic contamination, and are suitable for metal-sensitive processes.
- Application: Often used for post-CMP cleaning of polishing pads and light conditioning.
3.Composite Conditioning Disks:
- Features: Combine the conditioning power of diamond disks and the low-defect characteristics of soft brushes, optimizing defect rates through adjustable hardness and bristle shape.
- Application: Suitable for complex processes involving multiple material polishing, such as advanced packaging and 3D integration.
CMP Grinding Plate Key Performance Parameters
|
Parameter Name
|
Typical Value/Range
|
Significance
|
|
Diameter
|
95mm–600mm
|
Adapts the disk size to different CMP equipment
|
|
Diamond Grit Size
|
74μm–251μm
|
Influences conditioning aggressiveness and surface roughness
|
|
Base Material
|
Stainless Steel, Ceramic, Polymer
|
Determines rigidity, corrosion resistance, and applicable processes
|
|
Conditioning Life
|
Up to hundreds of hours
|
Directly impacts consumable cost and equipment downtime
|
|
Flatness
|
≤ 0.5μm
|
Ensures conditioning uniformity and wafer planarization results
|
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Q1: What is the main purpose of a CMP grinding plate (conditioner disk)?
A1: Its primary function is to resurface and activate the polishing pad by removing glazed layers and debris, ensuring consistent polishing rates and achieving global nanoscale planarization of wafers during chemical mechanical polishing (CMP).
Q2: Why choose a silicon carbide (SiC) diamond grinding plate for CMP?
A2: Silicon carbide diamond grinding plates offer exceptional hardness (Mohs 9+), high wear resistance, thermal stability, and chemical inertness, making them ideal for maintaining pad roughness and extending service life in demanding semiconductor CMP processes.
Tags: #CMP Grinding Plate, #Customized, #Chemical Mechanical Polishing of Wafers
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