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SiC Substrate
Created with Pixso. Premium 3C-SiC Substrates: N-Type Production Grade Wafers for 5G & Power Electronics

Premium 3C-SiC Substrates: N-Type Production Grade Wafers for 5G & Power Electronics

Brand Name: ZMSH
Model Number: 3C-N SiC
MOQ: 10pc
Price: by case
Delivery Time: in 30days
Payment Terms: T/T
Detail Information
Place of Origin:
CHINA
Certification:
rohs
Size:
2inch,4inch,6inch,5×5,10×10
Dielectric Constant:
9.7
Surface Hardness:
HV0.3>2500
Density:
3.21 G/cm3
Thermal Expansion Coefficient:
4.5 X 10-6/K
Breakdown Voltage:
5.5 MV/cm
Applications:
Communications, Radar Systems
Packaging Details:
customzied plastic box
Supply Ability:
1000pc/month
Highlight:

N-Type 3C-SiC production wafers

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5G power electronics SiC substrates

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Premium SiC wafers with warranty

Product Description

Premium 3C-SiC Substrates: N-Type Production Grade Wafers for 5G & Power Electronics

Pioneering Third-Generation Semiconductor Solutions

Premium 3C-SiC Substrates: N-Type Production Grade Wafers for 5G & Power Electronics 0

Fig 1. High-Purity 3C-SiC Semiconductor Wafer

With over a decade of dedicated expertise, ZMSH stands at the forefront of advanced material R&D. We deliver highly customized semiconductor substrates—including SiC, Silicon, Sapphire, and SOI wafers. Our silicon carbide portfolio comprehensively covers 4H, 6H, and 3C polytypes, offering scalable supply chains from 2-inch research samples to 12-inch mass-production wafers.

Built for Extreme Performance:
Our N-type 3C-SiC substrates are meticulously engineered for next-generation high-frequency power components and automotive EV inverters. They dramatically outperform traditional silicon by offering extraordinary thermal stability (up to 1,600°C) and superior thermal conductivity (49 W/m·K). Manufactured to rigorous aerospace-grade international standards, these wafers guarantee unwavering reliability in the most demanding operational environments.

Substrate Core Features

1. Versatile Dimensional Scalability:
  • Standard Formats: Available in 2", 4", 6", and 8" diameters.
  • Bespoke Geometry: Custom sizing starts from micro-dimensions of 5×5 mm to client-specific layouts.
2. Ultra-Low Defect Architecture:
  • Microvoid densities are strictly maintained below 0.1 cm⁻².
  • Exceptional resistivity control (≤0.0006 Ω·cm) ensures maximum device yield and reliability.
3. Seamless Process Compatibility:
  • Optimized for intense fabrication steps like high-temperature oxidation and advanced lithography.
  • Superior surface flatness achieved at λ/10 @632.8 nm.

Material Properties & Advantages

■ Exceptional Electrical Dynamics

Boasting a remarkable electron mobility of 1,100 cm²/V·s, our 3C-SiC significantly eclipses standard 4H-SiC (900 cm²/V·s), translating to minimal conduction losses. Its 3.2 eV wide bandgap empowers the substrate to handle massive voltage loads up to 10 kV.

■ Unmatched Thermal Management

With a thermal conductivity rating of 49 W/m·K, it effortlessly surpasses conventional silicon. This allows devices to operate securely across extreme temperature spectrums, from cryogenic -200°C up to blistering 1,600°C environments.

■ Ultimate Chemical Resilience

Highly impervious to aggressive acids, strong alkalis, and intense ionizing radiation, making it the material of choice for nuclear infrastructure and deep-space aerospace modules.

Detailed Technical Specifications

Parameter Z-Grade
(Zero MPD Production)
P-Grade
(Standard Production)
D-Grade
(Dummy Grade)
Diameter 145.5 mm – 150.0 mm
Thickness 350 μm ± 25 μm
Wafer Orientation Off axis: 2.0°–4.0° toward [1120] ± 0.5° (4H/6H-P)
On axis: <111> ± 0.5° (3C-N)
* Micropipe Density 0 cm⁻²
* Resistivity (p-type 4H/6H-P) ≤ 0.1 Ω·cm ≤ 0.3 Ω·cm
* Resistivity (n-type 3C-N) ≤ 0.8 mΩ·cm ≤ 1.0 mΩ·cm
Primary Flat Orientation 4H/6H-P: {1010} ± 5.0° | 3C-N: {110} ± 5.0°
Primary Flat Length 32.5 mm ± 2.0 mm
Secondary Flat Length 18.0 mm ± 2.0 mm
Secondary Flat Orientation Silicon face up, 90° CW from Prime flat ± 5.0°
Edge Exclusion Area 3 mm 6 mm
LTV / TIV / Bow / Warp ≤ 2.5 μm / ≤ 5 μm / ≤ 15 μm / ≤ 30 μm ≤ 10 μm / ≤ 15 μm / ≤ 25 μm / ≤ 40 μm
* Roughness (Polish) Ra ≤ 1 nm
* Roughness (CMP) Ra ≤ 0.2 nm Ra ≤ 0.5 nm
Edge Cracks None Cum. length ≤ 10 mm, single ≤ 2 mm
* Hex Plates Cum. area ≤ 0.05% Cum. area ≤ 0.1%
* Polytype Areas None Cum. area ≤ 3%
Visual Carbon Inclusions None Cum. area ≤ 0.05%
# Si Surface Scratches None Cum. length ≤ 1 × wafer diameter
Edge Chips None permitted ≥ 0.2mm width/depth Max 5 allowed, ≤ 1 mm each
Si Surface Contamination None
Packaging Multi-wafer Cassette or Single Wafer Container

Notes: Defects limits apply to the entire wafer surface except for the edge exclusion area. Scratches (*) should be checked on the Silicon face only under High Intensity Light.

Primary Application Scenarios


1. High-Frequency RF & 5G Communications

Vital as RF device substrates for 5G Base Stations, allowing efficient mmWave signal propagation. Crucial for Advanced Radar Systems where low attenuation ensures precision targeting.

2. Electric Mobility (EVs)

Revolutionizes On-Board Chargers (OBC) by cutting energy losses by 40% in 800V architectures. Upgrades DC/DC Converters to reduce energy waste by up to 90%, significantly boosting vehicle range.

3. Green Energy & Industrial Grids

Increases Solar Inverter efficiency by 1-3% while slashing component volume by half. Enables Smart Grids to operate with smaller footprints and minimal cooling requirements.

4. Aerospace & Defense

Deploys Radiation-Hardened Devices to replace vulnerable silicon in orbital satellites and launch vehicles, drastically extending mission lifespans.

3C-SiC Substrates FAQ

Q1: What exactly is a 3C-SiC substrate?

A: 3C-SiC refers to cubic silicon carbide. It is a highly specialized semiconductor material characterized by a cubic crystalline structure. It delivers phenomenal electron mobility (1,100 cm²/V·s) and robust thermal conductivity (49 W/m·K), making it the premier choice for extreme-temperature and high-frequency circuitry.

Q2: Which industries primarily utilize 3C-SiC technology?

A: Because of its low signal loss and radiation hardness, 3C-SiC is heavily utilized in manufacturing 5G RF communication modules, high-efficiency Electric Vehicle (EV) inverters, and resilient electronics for aerospace and satellite applications.

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