| Brand Name: | ZMSH |
| MOQ: | 25 |
| Delivery Time: | 2-4 weeks |
| Payment Terms: | T/T |
Our 6 Inch Sapphire Wafers are manufactured from high-quality single-crystal aluminum oxide (Al₂O₃) and are designed for semiconductor, optoelectronic, optical and precision engineering applications.
With excellent mechanical strength, chemical stability, thermal resistance and optical performance, sapphire wafers are widely used as substrates for LED, GaN epitaxy, RF devices, optical components, sensors and advanced research applications.
We provide 150 mm / 6 inch sapphire wafers with customized crystal orientation, thickness, surface finish, flatness, edge treatment and polishing specifications.
Both SSP (Single Side Polished) and DSP (Double Side Polished) wafers are availabe.
| Parameter | Specification |
|---|---|
| Product | Sapphire Wafer / Sapphire Substrate |
| Material | Single Crystal Sapphire, Al₂O₃ |
| Diameter | 6 Inch / approx. 150 mm |
| Crystal Orientation | C-Plane, A-Plane, R-Plane or Custom |
| Thickness | Customizable |
| Thickness Tolerance | According to Customer Specification |
| Surface | SSP / DSP |
| Polished Side | Single Side or Double Side |
| Surface Finish | Optical Polished |
| Surface Roughness | Customizable according to application |
| TTV | Customizable |
| Bow | Customizable |
| Warp | Customizable |
| Edge | Ground / Chamfered / Polished |
| Flat / Notch | Optional / Custom |
| Transparency | High Optical Transparency |
| Color | Transparent / Colorless |
| Quantity | Prototype, Small Batch and Mass Production |
| Packaging | Wafer Cassette / Wafer Carrier / Clean Packaging |
| Customization | Available according to drawing or technical specification |
Different sapphire crystal orientations can be supplied depending on the customer's application.
C-plane sapphire is one of the most commonly used sapphire substrate orientations and is widely applied in:
GaN epitaxy
LED manufacturing
Semiconductor research
Thin-film deposition
Optical applications
A-plane sapphire can be used for specialized epitaxial growth, optical components and research applications.
R-plane sapphire is commonly selected for applications requiring specific crystal orientation, optical performance or epitaxial characteristics.
Custom crystal orientations can also be evaluated according to customer requirements.
We offer both single-side polished and double-side polished sapphire wafers.
One surface is precision polished while the opposite surface remains ground or fine finished.
Suitable for:
Epitaxial growth
Semiconductor processing
Coating
General substrate applications
Both surfaces are precision polished to provide high transparency and excellent surface quality.
Suitable for:
Optical applications
Transparent substrates
Wafer bonding
MEMS
Precision inspection
Advanced research
High mechanical strength
High hardness and wear resistance
Excellent chemical stability
High temperature resistance
Good dielectric properties
Excellent optical transparency
High-quality polished surface
Stable crystal structure
Suitable for semiconductor processing
Available in custom thickness and orientation
SSP and DSP options available
Small quantity samples and batch production supported
6-inch sapphire wafers are widely used in:
GaN epitaxy
LED substrate
Semiconductor wafer processing
Compound semiconductor devices
RF devices
Power electronics research
Optical windows
Infrared optical components
Laser systems
High-temperature optical systems
Transparent protective components
Thin-film deposition
PVD / CVD processes
Wafer bonding
MEMS
Sensor development
Material science research
University laboratory applications
We can manufacture sapphire wafers according to specific technical requirements.
Custom options include:
Wafer diameter
Wafer thickness
Crystal orientation
SSP or DSP
Surface roughness
TTV
Bow
Warp
Flatness
Edge profile
Chamfer
Flat or notch
Surface quality
Cleaning and packaging
Customers can send us their drawings, datasheets or target specifications for evaluation.
Sapphire wafer quality can be inspected according to customer requirements, including:
Diameter
Thickness
Thickness tolerance
TTV
Bow
Warp
Surface roughness
Crystal orientation
Edge quality
Surface scratches
Chips
Cracks
Contamination
Optical appearance
For semiconductor and precision applications, customized inspection standards can be discussed before production.
Sapphire wafers can be individually separated and packed in suitable wafer carriers or cassettes to reduce surface contact and transportation damage.
Available packaging options include:
Wafer cassette
Wafer carrier
Individual protective packaging
Clean PE packaging
Vacuum packaging
Customized export packaging
The wafer carrier shown in the product images is primarily used for safe storage, handling and transportation of sapphire wafers.
We support sapphire wafer projects from prototype development to volume production.
Our services include:
Custom sapphire wafer manufacturing
Precision crystal orientation
Grinding and lapping
SSP polishing
DSP polishing
Edge processing
Dimensional inspection
Surface quality inspection
Custom packaging
Small-batch sampling
Mass-production supply
For special wafer requirements, please provide your required diameter, thickness, orientation, polishing type, TTV, Bow, Warp and surface roughness for quotation.
For a fast quotation, please provide:
Wafer diameter
Thickness
Crystal orientation
SSP or DSP
Surface roughness requirement
TTV / Bow / Warp requirement
Flat or notch requirement
Quantity
Application
We can evaluate both standard and fully customized sapphire wafer specifications.