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Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials

Name: Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials
Uploaded: 2025-10-11CDT10:59:36-05:00
Duration: 1 min 1 s
Description: Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials, Find Complete Details about Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials from SHANGHAI FAMOUS TRADE CO.,LTD Supplier or Manufacturer on galliumnitridewafer.com

Semiconductor Equipment

2025-10-11

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#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace

Equipment Overview and Core Value Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials The wire saw equipment utilizes a high-speed diamond wire ... View More

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Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials

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Gallium Nitride Wafer

Sapphire Wafer

SiC Substrate

Sapphire Optical Windows

IC Silicon Wafer

Synthetic Sapphire Rod

Fused Quartz Plate

Sapphire Parts

Synthetic Gemstone

Semiconductor Equipment

LiNbO3 Wafer

GaAs Wafer

Indium Phosphide Wafer

Ceramic Substrate

Lab Wrapper

Gallium Nitride Wafer

Sapphire Wafer

SiC Substrate

Sapphire Optical Windows

IC Silicon Wafer

Synthetic Sapphire Rod

Fused Quartz Plate

Sapphire Parts

Synthetic Gemstone

Semiconductor Equipment

LiNbO3 Wafer

GaAs Wafer

Indium Phosphide Wafer

Ceramic Substrate

Lab Wrapper

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

Multi-Wire Saw Machine High-Precision Diamond Wire Cutting​​

​​Multi-Wire Saw Machine for Cutting Silicon/Sapphire Ingots/Quartz​​ Semiconductor Materials

​​Multi-Function Multi-Wire Saw Machine For Cutting Sapphire/Silicon/Quartz Stone Materials​​

Robotic Polishing Machine for Flat/Spherical/Aspherical Optical Components Processing

Multi-Wire Saw Cutting Machine for Natural Stone Processing

355nm/532nm/1064nm Switchable Chromatic Laser Processing Equipment

355nm/532nm/1064nm Chromatic Laser Marking System for Stainless Steel

​​High-Precision Single-Side Polishing Equipment for Si Wafers/SiC/Sapphire Materials​​

​​High-Precision Double-Sided Grinding/Polishing Equipment for Sapphire/Glass/Quartz

Double-Sided Precision Grinding Machine for Metals/Non-Metals/Ceramics/Plastics

Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials

Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic Material

Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC / Sapphire / Silicon Processing

Diamond Wire / Multi-Wire / High-Speed / High-Precision / Descending / Oscillating Cutting Machine

Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing

Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials

Multi-Wire Saw Machine High-Precision Diamond Wire Cutting

Multi-Wire Saw Machine for Cutting Silicon/Sapphire Ingots/Quartz Semiconductor Materials

Multi-Function Multi-Wire Saw Machine For Cutting Sapphire/Silicon/Quartz Stone Materials

High-Precision Single-Side Polishing Equipment for Si Wafers/SiC/Sapphire Materials

High-Precision Double-Sided Grinding/Polishing Equipment for Sapphire/Glass/Quartz