Abstract of Semi-automatic room temperature bonding machine Semi-automatic room temperature bonding machine 2/4/6/8/12inch Compatible material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass Semi-Automatic ... Read More
3inch HPSI Silicon Carbide SiC Substrate Thickness 500um Prime Grade Dummy Grade Research Grade Translucent About HPSI HPSI SiC wafer is an advanced semiconductor material, which is widely used in electronic ... Read More
Silicon carbide (SiC) Substrate Option for High-Standard Industrial Applications Product Description: This product is dopant-free, making it ideal for a wide range of applications. Whether you're working on a ... Read More
TGV(Through-Glass Via)technology High quality borosilicate glass quartz Technical introduction In the field of advanced packaging, Through-Glass Via (TGV) is widely considered by the semiconductor industry as a ... Read More
Overview of Diamond Wire Single-Line Cutting Machine Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic Material The diamond wire single-line cutting machine is a high-precision processing ... Read More
SiC wafer, Silicon Carbide Wafer, SiC Substrate, Silicon Carbide Substrate, P Grade, D Grade, 2inch SiC, 4inch SiC, 6inch SiC, 8inch SiC, 12inch SiC, 4H-N, 4H-SEMI, 6H-N, HPSI type Character of 4H-N SiC - use ... Read More
Product Description: 6Inch Sic Silicon Carbide Substrate 6H-P Type For Communications and radar systems Diameter 150mm Prime Grade 6H-SiC (Hexagonal Silicon Carbide) is a wide bandgap semiconductor material ... Read More