Small-Size Sapphire TGV Micro-Via Wafer for Laboratory Prototyping, MEMS Devices and Optical Micro-Structure Applications

ZMSH small-size Sapphire TGV (Through-Glass Via) micro-via wafers are engineered for high-precision micro-structure applications that require extreme optical clarity, dimensional accuracy, and long-term stability. Using advanced laser TGV drilling on optical-grade sapphire substrates, these wafers provide reliable electrical and optical pathways along with robust structural support for next-generation microsystems, including MEMS sensors, microfluidic devices, and compact optoelectronic modules.

Compared with standard borosilicate TGV substrates, sapphire offers higher mechanical strength, superior thermal resistance, excellent chemical durability, and optical transparency across UV–IR wavelengths, making it ideal for demanding laboratory and research environments.

Key Features:

• Ultra-Precision TGV Micro-Vias

  • Hole diameter: 5–200 μm

  • Position accuracy: ±2 μm

  • High aspect ratio via processing

  • Smooth sidewalls for stable electrical and optical coupling

• Optical-Grade Sapphire

  • Transmittance: 200 nm–5 μm (UV–IR)

  • Excellent surface flatness and low birefringence

  • Scratch-resistant (Mohs 9)

  • Ideal for optical sensing, imaging, and micro-structure applications

• Extreme Reliability

  • Heat resistance: >1500°C

  • High dielectric strength and insulation reliability

  • Resistant to acids, alkalis, and solvents

  • Mechanically robust for long-term operation

• Designed for Integration

  • Compatible with metal coatings (Ti/Pt/Au, Cr/Au, Ni/Au)

  • Suitable for bonding, anodic sealing, and direct-attach packaging

  • Supports hybrid MEMS and optical integration

Customizable Parameters:

1. Substrate Options

   • Diameter: 3–50 mm (typical: 10 / 12 / 15 mm small wafers)

   • Thickness: 0.1–1.0 mm

   • Edge profile: chamfered, polished, deburred

2. Micro-Via Design

   • Hole diameter: 5–200 μm

   • Hole pitch: ≥30 μm

   • Array layout: grid, ring, logo-shaped, or irregular pattern

   • Via density: up to 10,000+ holes per wafer

   • Tolerance: ±2–5 μm

3. Surface Processing

   • Single or double-side polishing

   • AR / AF / DLC coatings

   • Metalized vias (optional)

   • Laser-etched fiducials for alignment

Typical Applications:

• MEMS & Sensor Devices: Pressure sensors, inertial units, IR/UV microsensors, biosensors

• Microfluidic & Biomedical Chips: Controlled fluidic pathways, droplet generation, micro-reaction systems

• Optoelectronic Packaging: VCSEL/PD modules, micro-LED, optical connectors, LiDAR micro-optics

• Semiconductor Packaging & Interposers: Miniaturized interposers, glass-based packaging, RF modules

• Research & Prototyping: University labs, research institutes, custom micro-structure experiments

Technical Specifications (Typical Example):

(Full customization available)

Why Choose ZMSH Sapphire TGV Micro-Via Wafers?

• Industry-grade precision micro-drilling

• Custom patterns with fast turnaround

• Strict optical, dimensional, and cleanliness control

• Engineering support for MEMS, microfluidics, and photonics

• Suitable for prototyping to small-volume production

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