6–8 Inch Silicon and SiC Wafer Polishing Line with Quad Heads and Closed-Loop Mounting

Product Overview

The 6–8 inch Semiconductor Wafer Polishing Automation Line is a fully integrated post-polishing production system designed for silicon and silicon-carbide (SiC) wafers.

It combines quad-head polishing, automatic wafer de-mounting, ceramic carrier management, precision cleaning, and high-accuracy wafer re-mounting into a single closed-loop automation platform.

This system enables continuous, contamination-controlled, high-yield wafer processing, making it ideal for power semiconductor fabs, SiC substrate manufacturers, and advanced packaging wafer lines.

System Architecture

The entire line consists of four highly coordinated process modules:

1. Automatic Wafer De-Mounting Unit

After quad-polishing, wafers are automatically separated from ceramic carriers using low-stress, controlled motion algorithms, preventing:

• Edge chipping

• Micro-cracks

• Residual stress damage

This is especially critical for brittle and high-value SiC wafers.

2. Ceramic Carrier Storage & Buffer System

Ceramic carriers are automatically sorted, stored, and dispatched.
The buffer system allows:

• Continuous operation of the polishing line

• Multi-spec carrier compatibility

• Stable takt time control

This eliminates production interruptions caused by manual handling or carrier shortage.

3. Ultra-Clean Ceramic Carrier Washing System

Before re-mounting, each ceramic carrier undergoes deep-level precision cleaning to remove:

• Polishing slurry

• Sub-micron particles

• Chemical residues

This ensures a repeatable, contamination-free surface for every new wafer mounting cycle.

4. High-Precision Wafer Re-Mounting Unit

Wafers are mounted onto cleaned carriers with:

• Controlled pressure

• Sub-micron alignment

• Ultra-high flatness control

This provides the ideal initial condition for the next quad-polishing step, directly improving polishing uniformity and final wafer quality.

Key Process Advantages

Ultra-High Cleanliness

Mounting area cleanliness:

• ≥ 0.5 µm particles: < 50 ea

• ≥ 5 µm particles: < 1 ea

Fully compliant with advanced power semiconductor and SiC manufacturing standards.

Exceptional Mounting Flatness

Mounting flatness ≤ 2 µm
This ensures:

• Uniform polishing pressure

• Stable material removal rates

• Superior thickness uniformity

Critical for high-performance power devices and advanced packaging wafers.

Flexible High-Throughput Production

The system allows manufacturers to balance throughput, cost, and surface quality based on their production strategy.

Technical Specifications

• Wafer Size: 6–8 inch Silicon & SiC wafers

• Equipment Dimensions: 13,643 × 5,030 × 2,300 mm (L × W × H)

• Power Supply: AC 380 V, 50 Hz

• Total Power Consumption: Approx. 119 kW

• Mounting Flatness: ≤ 2 µm

• Mounting Cleanliness:
  ≥0.5 µm < 50 ea, ≥5 µm < 1 ea

Application 

• Si and SiC power semiconductor wafers (MOSFET, IGBT, diodes)

• SiC substrates and epitaxial wafers

• Advanced packaging and interposer wafers

• Precision device-grade polished wafers

After-Sales Service & Support

• 24/7 remote and on-site technical support

• Response within 2 hours

• On-site arrival: within 24 hours (local) / 36 hours (non-local)

• Free warranty repair and service

• Lifetime maintenance and spare-parts support

• Critical spare parts always in stock

• Regular preventive maintenance visits by field engineers

FAQ – Frequently Asked Questions

Q1: Is this line suitable for both silicon and SiC wafers?

Yes. The system is specifically optimized for both silicon and silicon-carbide wafers. Motion profiles, mounting pressure, and de-mounting trajectories are tuned to handle the high hardness and brittleness of SiC safely.

Q2: How does this system improve polishing yield?

By combining ultra-clean carriers, high flatness mounting, and fully automated handling, the system minimizes:

• Particle contamination

• Wafer warpage

• Pressure non-uniformity
  This leads to more stable polishing, lower breakage rates, and higher wafer yield.

Q3: Can the system run continuously with the quad-polisher?

Yes. The carrier buffer and automated logistics are designed to allow 24/7 continuous operation, keeping the quad-polisher running without waiting for manual loading or cleaning.

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