

home

about us

Company Profile

factory tour

quality control

FAQ

products

GaAs Wafer

solutions

blog

Shopping

Quote

Recommend these videos for you

Replay

Next Video

Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing

Name: Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing
Uploaded: 2026-01-06CST10:36:52-06:00
Duration: 17 s
Description: Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing, Find Complete Details about Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing from SHANGHAI FAMOUS TRADE CO.,LTD Supplier or Manufacturer on galliumnitridewafer.com

Semiconductor Equipment

2026-01-06

Chat Now

#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace

Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing Product Description The ZMSH Wafer Mounting Ring, also known as a Wafer Frame Ring or Dicing Ring, is a precision... View More

Messages of visitor Leave a message

Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing

Chat Now

Learn More

Gallium Nitride Wafer

Sapphire Wafer

SiC Substrate

Sapphire Optical Windows

IC Silicon Wafer

Wire Saw Machine

Synthetic Sapphire Rod

Fused Quartz Plate

Sapphire Parts

Synthetic Gemstone

Semiconductor Equipment

LiNbO3 Wafer

Indium Phosphide Wafer

Ceramic Substrate

Lab Wrapper

GaAs Wafer

Gallium Nitride Wafer

Sapphire Wafer

SiC Substrate

Sapphire Optical Windows

IC Silicon Wafer

Wire Saw Machine

Synthetic Sapphire Rod

Fused Quartz Plate

Sapphire Parts

Synthetic Gemstone

Semiconductor Equipment

LiNbO3 Wafer

Indium Phosphide Wafer

Ceramic Substrate

Lab Wrapper

GaAs Wafer

Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing

Robotic Polishing Machine for Flat/Spherical/Aspherical Optical Components Processing

355nm/532nm/1064nm Switchable Chromatic Laser Processing Equipment

355nm/532nm/1064nm Chromatic Laser Marking System for Stainless Steel

​​High-Precision Single-Side Polishing Equipment for Si Wafers/SiC/Sapphire Materials​​

​​High-Precision Double-Sided Grinding/Polishing Equipment for Sapphire/Glass/Quartz

Double-Sided Precision Grinding Machine for Metals/Non-Metals/Ceramics/Plastics

​​CO₂ Laser Cutting Machine with Gas Laser Technology for Tube Cutting 80W-180W

​​CO₂ Laser Marking Machine for Non-Metallic Materials with Operating Temperature 0-50°C​​

​​355nm UV Laser Marking Machine 3W-25W for Various Plastic Marking​​

End-Pumped Laser Marking Machine 6W-30W High-Precision Marking 1064nm Wavelength

6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized

Fiber Laser Marking Machine 20W-100W for Marking on Stainless Steel/Components

Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material

Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch

High-Precision Single-Side Polishing Equipment for Si Wafers/SiC/Sapphire Materials

High-Precision Double-Sided Grinding/Polishing Equipment for Sapphire/Glass/Quartz

CO₂ Laser Cutting Machine with Gas Laser Technology for Tube Cutting 80W-180W

CO₂ Laser Marking Machine for Non-Metallic Materials with Operating Temperature 0-50°C

355nm UV Laser Marking Machine 3W-25W for Various Plastic Marking