Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing

Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing

Product Description

The ZMSH Wafer Mounting Ring, also known as a Wafer Frame Ring or Dicing Ring, is a precision-engineered stainless steel frame designed for secure wafer handling in semiconductor manufacturing processes such as dicing, back grinding, polishing, bonding, and temporary transportation.

Manufactured from 420 stainless steel, the wafer mounting ring provides excellent rigidity, flatness, and dimensional stability. When used together with dicing tape or UV tape, it ensures reliable wafer fixation, minimizes vibration and slippage, and helps improve yield during high-precision wafer processing.

ZMSH wafer mounting rings are reusable and compatible with professional cleaning and refurbishment processes, making them a cost-effective and reliable solution for wafer fabs, OSATs, and semiconductor laboratories.

Product Features

• Made from 420 stainless steel with high hardness and wear resistance

• Excellent flatness and rigidity for high-speed, high-precision dicing

• Stable performance under repeated cleaning and reuse cycles

• Smooth surface finish for cleanroom compatibility

• Suitable for both manual and automated wafer handling systems

• Customizable dimensions, thickness, and edge design available

Technical Parameters

Standard Specifications

Size Reference Table

Note: Dimensions can be customized according to drawings or samples.

Applications

ZMSH wafer mounting rings are widely used in:

• Semiconductor wafer dicing / die saw processes

• Wafer back grinding and thinning

• Film mounting with blue tape or UV tape

• Die attach and bonding processes

• LED and power semiconductor packaging

• Temporary wafer holding and transportation

Additional Information & Services

• Professional wafer frame cleaning and refurbishment

• Laser engraving (serial number, QR code, barcode, logo)

• Custom sizes, thicknesses, and special edge designs

• Cleanroom-grade or vacuum packaging

• Technical support for drawing review and application matching

Ordering & Customization Process

1. Submit drawings or physical samples for technical evaluation

2. Confirm specifications, tolerances, and surface requirements

3. Receive quotation based on quantity and customization

4. Approve pre-production sample

5. Mass production with full inspection and delivery

Frequently Asked Questions (FAQ)

1. What is the main function of a wafer mounting ring?

A wafer mounting ring is used together with dicing tape or UV tape to securely fix semiconductor wafers during processes such as dicing, back grinding, polishing, and bonding. It provides mechanical rigidity and dimensional stability, preventing wafer movement, vibration, and misalignment during high-precision processing.

2. Why choose a 420 stainless steel wafer mounting ring instead of plastic or resin rings?

Compared with plastic or resin rings, 420 stainless steel wafer mounting rings offer significantly higher rigidity, flatness stability, and wear resistance. They are better suited for high-speed dicing, repeated cleaning cycles, and high-precision semiconductor manufacturing where dimensional consistency and long service life are critical.

3. Can ZMSH wafer mounting rings be reused after cleaning?

Yes. ZMSH wafer mounting rings made from 420 stainless steel are designed to be reusable. With proper professional cleaning to remove tape residue, adhesive, and particles, the rings can be reused multiple times without affecting flatness or performance.