SiC Ceramic:

Product Information
emr cramiolicon cnries seramie an aanc ceramie materioiaisi medsef sleon casiaos akerscoxcollenhighdesign and operating conditions, Sic ceramics can be manufactured into ubes,rings, cyinders, plates, trays, supports, sleeves, and othe
semiconductor processing, thermal treatment high temperature equipment, and advanced materlal applications. Depending on the equipment
complex customized structures
Manufacturing Process
A typical SiC ceramic manufacturing process includes:Raw Material Selection & Preparation
Forming / Preform Preparation
Sintering / Densification
Precision CNC Machining
Grinding /Polishing
Cleaning & Inspection
Final Packaging & Shipment
The actual manufacturing route varies according to the SiC material system, product geomelry, dimensions, and operating conditions
Key Features
1.优异的高温稳定性|Excellent High-Temperature Stability
SiC ceramic component should be confirmed according to its material grade and process conditions
2.良好导热性能|High Thermal Conductivity
High thermal conductivity helps promote efficient heat transfer and more uniform temperature distribution.
3. 优异抗热震性能 Excellent Thermal Shock Resistance
Suitable for processes involving repeated heating and cooling cycles.
4. High Mechanical Strength & Stiffness
High mechanical strength and stiffness help maintain structural stability during long-term high-temperature operation.
5.Chemical Stability
Sutable for demandng environments involing corrosive gases, plasma, and other chemically aggressive conditions
6. Precision Machining
Dimensions, holes, slots, and complex structures can be precision-machined according to customer drawings, with grinding and polishing
available as required.
7.Customizable
The product can be customized in terms of:
Dimensions, thickness, shape, holes, slots, structure, and surface finish.
Key Specifications
Materia
Parameter
Material Type
Purity
Density
Operating Temperature
Shape
Size
ThicknessStructureSurface FinishTolerance
Mounting Holes
Slot Geometry
OEM/ODM
Silicon Carhide (SiC)Different SiC material systems depending on application
Up to 99.9%*2.3-3.9 g/cm'≤1600°C*
Cylindrical, ring, plate, and other customized shapesCustomized
Customized
CustomizedGround / Polished / Precision MachinedAccording to drawing and application requirementsCustomized
Customized
Supported
Applications
1.Semiconductor Manufacturing
Used as high-temperature carriers, supports, positioning components, and other precision ceramic parts in semiconductor equipment.
2.CVD/ PECVD CVD/ PECVD Processing
Suitable for CVD and PECVD semiconductor processing systems.
3.High-Temperature Furnaces & Thermal Processing
Used in vacuum furnaces, high-temperature sintering systems, and thermal processing equipment.
4.LED & Optoelectronics
Applications include sapphire wafer processing, LED epitaxy carrier systems, and high-temperature substrate support.
5.Powder Metallurgy & Advanced Materials
Suitable for advanced ceramic sintering, powder metallurgy, and battery-material thermal processing.
FAQ
Q1. What is SiC Ceramic?
Sis ergmnic an anced erami maalerlal primarly made of slicon carbide, ofering high-temperature stablty. good thermal conductvty,
Q2. Can SiC ceramic components be customized?
Yes. Dimensions, thickness, holes, slots, and complex structures can be customized according to customer drawings.
Q3. What information is required for quotation?
We recommend providing:
Poril tandar pa 2b arag CA tle Is nignly recotmenence Quantity +Application + operating Temperature
Q4. What SiC materials are available?
ah rorieed produd iniamation sts ceir sins nd si g poropriate material should be selected acorcing to temperature.
Q5. Can SiC ceramic be polished?
Yes. Grinding and polishing can be provided according to the application and surface-finish requirements.
Q6. Can you provide OEM/ODM?
Yes. OEM/ODM customization is available based on customer drawings and application requirements.
Q7. How do I choose the right SiC material?
Materal selection should be based mainly on operating temperature, process atmosphere, purity requirements, contamination control.
mechanical structure, and cost targets
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