Laser Holographic Anti-Counterfeiting Marking equipment with 2500W Output Power Abstract of Laser Holographic Anti-Counterfeiting Equipment Laser-induced Structural Color Lithography (LSCL) is a high-precision ... Read More
Product Description High-precision laser drilling machine with high efficiency micro-hole processing wavelength 1064nm · Laser source: The core component, usually using fiber lasers, CO2 lasers or ultraviolet ... Read More
Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed ... Read More
Abstract Gallium arsenide optical fiber temperature sensor Small probe size 0.5mm temperature measurement accuracy ±0.1℃ Gallium arsenide (GaAs) optical fiber temperature sensor is a kind of non-contact ... Read More
Abstract of microjet laser technology equipment Microjet laser technology equipment wafer slice metal silicon carbide material Microjet Laser systems enable ultra-precision machining of semiconductor materials ... Read More
Abstract of microjet laser technology equipment Microfluidic laser equipment for semiconductor wafer processing Microjet laser technology is an advanced and widely used composite processing technology, which ... Read More
Bionic anti-slip pad Abstract Bionic non-slip pad High friction low adhesion wafers carry bionic friction pad suction cups Bionic anti-slip pad is a high-performance anti-slip tool that mimics biological ... Read More
Abstract Monocrystalline silicon double station square machine 6/8/12 inch burr ≤0.5mm high precision ±0.05mm In the field of semiconductor materials processing, monocrystalline silicon two-root vertical open... Read More