4H-SEMI SiC

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August 22, 2024
Keyword: SiC Substrate
Video Description:
Discover the 4H-SEMI SiC Substrate Cutting Disc, a high-hardness solution for precision cutting. With a diameter of 10mm and thickness of 5mm, this SiC wafer is ideal for high-frequency, high-power electronic devices. Customizable and durable, it's perfect for industrial and scientific applications.