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Microfluidic laser equipment for semiconductor wafer processing

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April 02, 2025
Category Connection: Semiconductor Equipment
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Microjet laser technology is an advanced and widely used composite processing technology, which combines a water jet "as thin as a hair" with a laser beam, and guides the laser accurately to the surface of the machined part through total internal reflection in a manner similar to traditional optical fibers. The water jet continuously cools the cutting area and effectively removes the powder produced by processing.
Tags:
#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the advanced Microfluidic Laser Equipment for Semiconductor Wafer Processing, combining water jet precision with laser technology for high-accuracy, low-thermal-damage cutting and drilling in semiconductor manufacturing.
Related Product Features:
  • Diode-pumped solid state Nd:YAG laser with pulse width time us/ns and wavelengths 1064 nm, 532 nm, or 355 nm.
  • Low pressure pure deionized filtered water jet system with consumption of only 1 liter/hour at 300 bar pressure.
  • Nozzle size range 30-150 um, made of sapphire or diamond for precise laser guidance.
  • High pressure pumps and water treatment systems included for optimal performance.
  • Linear motor-driven XY and Z axes with positioning accuracy of +/-5 μm.
  • Surface roughness Ra≤1.6um with opening speed ≥1.25mm/s and linear cutting speed ≥50mm/s.
  • Suitable for gallium nitride, ultra-wide band gap semiconductor materials, and aerospace special materials.
  • Applications include wafer cutting, chip drilling, advanced packaging, and defect repair.
Faqs:
  • What is microjet laser technology used for?
    Microjet laser technology is used for high-precision, low-thermal-damage cutting, drilling, and structuring in semiconductors and advanced packaging.
  • How does microjet laser improve semiconductor manufacturing?
    It enables sub-micron accuracy with near-zero heat damage, replacing mechanical blades and reducing defects in brittle materials like GaN and SiC.
  • What materials can be processed with this equipment?
    The equipment processes materials such as silicon, silicon carbide, gallium nitride, diamond, gallium oxide, LTCC carbon ceramic substrate, and scintillator crystals.
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