Laser microjet cutting (LMJ) equipment
The Microjet Laser system uses the guiding and cooling effects of the liquid jet to couple the high-energy pulsed laser to the micron-scale liquid jet (usually deionized water or inert liquid), enabling ultra-precision machining of semiconductor materials.
Microjet laser technology, with its high precision, low damage and high cleanliness, is replacing traditional machining and dry laser processes in the semiconductor field, especially in third-generation semiconductors (SiC/GaN), 3D packaging and ultra-thin wafer processing.
Microjet laser technology, with its high precision, low damage and high cleanliness, is replacing traditional machining and dry laser processes in the semiconductor field, especially in third-generation semiconductors (SiC/GaN), 3D packaging and ultra-thin wafer processing.
Laser microjet cutting (LMJ) equipment
Wafer dicing
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Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material
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Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing
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6inch 8inch 12inch LPCVD Oxidation Furnace For Uniform Thin-Film Deposition
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Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
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Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing
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