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Home > Products > Semiconductor Equipment > Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing

Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing

Product Details

Place of Origin: CHINA

Brand Name: ZMSH

Certification: rohs

Model Number: Infrared Picosecond Dual-Platform Laser Cutting equipment

Payment & Shipping Terms

Minimum Order Quantity: 2

Price: by case

Delivery Time: 5-10months

Payment Terms: T/T

Get Best Price
Highlight:

Optical Glass Picosecond Laser Cutting Equipment

,

Sapphire Picosecond Laser Cutting Equipment

,

Quartz Picosecond Laser Cutting Equipment

Laser Type::
Infrared Picosecond
Platform Size::
700×1200 (mm) , 900×1400 (mm)
Cutting Thickness::
0.03-80 (mm)
Cutting Speed::
0-1000 (mm/s)
Cutting Edge Breakage::
<0.01 (mm)
Note::
Platform Size Can Be Customized.
Laser Type::
Infrared Picosecond
Platform Size::
700×1200 (mm) , 900×1400 (mm)
Cutting Thickness::
0.03-80 (mm)
Cutting Speed::
0-1000 (mm/s)
Cutting Edge Breakage::
<0.01 (mm)
Note::
Platform Size Can Be Customized.
Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing

 

Abstract

 

 

Infrared Picosecond Dual-Platform Laser Cutting System for Sapphire/Quartz/Optical Glass Processing

 

 

The infrared picosecond dual-platform glass laser cutting system is a high-end precision machining solution based on ultrafast laser technology. It utilizes a 1064nm infrared picosecond laser (pulse width 1-10ps) combined with a dual-station platform design, specifically engineered for precision processing of high-hardness brittle materials including sapphire, quartz glass, and optical glass.

 

Through a "cold processing" mechanism based on multiphoton absorption, the system achieves high-quality cutting with a heat-affected zone <1μm and surface roughness Ra<0.5μm, while maintaining ±2μm machining accuracy and 10μm minimum feature size capability. The dual-platform configuration enables alternating loading/unloading operations, improving processing efficiency by over 30% with cutting speeds reaching 100-500mm/s - making it particularly suitable for mass production of premium components like smartwatch covers, optical lenses, and semiconductor wafers.

 

 


 

Main parameter

 

 

Laser Type Infrared Picosecond
Platform Size 700×1200 (mm)
900×1400 (mm)
Cutting Thickness 0.03-80 (mm)
Cutting Speed 0-1000 (mm/s)
Cutting Edge Breakage <0.01 (mm)
Note: Platform size can be customized.

 

 


Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing 0

Working Principle

 

 

1. Ultrafast Laser Interaction Mechanism
Utilizing picosecond-level ultra-short pulse lasers (10^-12 second level) with extremely high peak power density (GW/cm² level) to instantaneously plasmaize materials, achieving atomic-level material removal.

 

2. Nonlinear Absorption Effect
Laser energy is captured by materials through multiphoton absorption processes, overcoming traditional linear absorption limitations to enable effective processing of transparent materials.

 

3. Dual-Station Collaborative Operation
Two independent processing platforms achieve parallel machining and loading/unloading operations through an intelligent scheduling system, maximizing equipment utilization efficiency.

 

 

Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing 1

Advantages

 


1. High degree of overall automation (cutting and breaking can be integrated), low power consumption, and simple operation.

 

2. The non-contact nature of laser processing enables techniques unachievable by traditional methods.

 

3. Consumable-free processing with lower operational costs and enhanced environmental friendliness.

 

4. High precision, zero taper, and no secondary damage to workpieces.

 

 

 


 

Process Applications

 

Suitable for precision cutting of various hard and brittle materials, including:

 

· Contour machining of standard/optical glass

· Cutting of ultra-hard materials (quartz, sapphire)

· Profile processing of tempered glass, filters, and mirrors

· Precise internal hole extraction

 

 

 

 

 

Processing Advantages

 

· Dual-platform integrated cutting/breaking with flexible switching;

· High-speed processing of complex profiles (30%+ efficiency improvement);

· Taper-free cuts with smooth, burr-free edges;

· Fully automatic model changeover with intuitive operation;

· Zero consumables, pollution-free (50% lower operating costs);

· No machining waste generation, ensuring surface integrity;

 

 


 

 

Machining effect——Sample display

 

 

 Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing 2

 

 


 

Q&A​

 

 

1. Q: What is an infrared picosecond dual-platform laser cutting system used for?
     A: It's designed for precision cutting of hard, brittle materials like sapphire, quartz, and optical glass, offering micron-level accuracy with minimal thermal damage.

 

 

2. Q: Why choose picosecond lasers over nanosecond for glass cutting?
     A: Picosecond lasers (vs nanosecond): 10x smaller heat-affected zone (<1μm), No micro-cracks or chipping, Higher edge quality (Ra<0.3μm),Suitable for ultra-thin glass (<0.1mm).

 

 


Tag: #Infrared Picosecond Dual-Platform Laser Cutting equipment, #Sapphire/Quartz/Optical Glass