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Infrared Nanosecond Laser Drilling Equipment Large-Format For Glass Substrates

Product Details

Place of Origin: CHINA

Brand Name: ZMSH

Certification: rohs

Model Number: Infrared Nanosecond Laser Drilling equipment

Payment & Shipping Terms

Minimum Order Quantity: 2

Price: by case

Delivery Time: 5-10months

Payment Terms: T/T

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Large Format Laser Drilling equipment

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Infrared Nanosecond Laser Drilling Equipment

Laser Type::
Infrared Nanosecond
Platform Size::
800*600(mm), 2000*1200(mm)
Drilling Thickness::
≤20(mm)
Drilling Speed::
0-5000(mm/s)
Drilling Edge Breakage::
<0.5(mm)
Note::
Platform Size Can Be Customized.
Laser Type::
Infrared Nanosecond
Platform Size::
800*600(mm), 2000*1200(mm)
Drilling Thickness::
≤20(mm)
Drilling Speed::
0-5000(mm/s)
Drilling Edge Breakage::
<0.5(mm)
Note::
Platform Size Can Be Customized.
Infrared Nanosecond Laser Drilling Equipment Large-Format For Glass Substrates

 

Abstract

 

 

Infrared Nanosecond Laser Drilling equipment Large-Format for Glass Substrates

 

 

The infrared nanosecond laser glass drilling system is an advanced manufacturing platform that utilizes 1064 nm infrared nanosecond pulsed lasers to achieve high-precision and high-efficiency micro-hole processing on glass substrates. By employing short pulses (1-100 ns) with high energy density, the system combines photothermal ablation and mechanical shock mechanisms to produce micron-scale apertures (20-500 μm) while effectively minimizing the heat-affected zone (HAZ) and preventing material cracking or edge chipping.

 

Compared to conventional mechanical drilling or CO₂ laser processing, this technology offers distinct advantages, including non-contact operation, zero tool wear, and exceptional flexibility, making it particularly suitable for complex micro-hole formation in ultra-thin glass and high-hardness brittle materials (e.g., quartz, sapphire glass). Key applications span consumer electronics (camera cover lenses, displays), photovoltaics (solar cells), automotive sensors, and medical microfluidic devices. The system is typically equipped with a large-format motion platform (e.g., ≥600×600 mm) and high-speed galvanometer scanning, enabling automated batch production with optimized throughput (hundreds of holes per second) and cost efficiency. As such, it has emerged as a critical technology in modern precision glass machining.

 

 


 

Main parameter

 

 

Laser type Infrared nanosecond
Platform size 800*600(mm)
2000*1200(mm)
Drilling thickness ≤20(mm)
Drilling speed 0-5000(mm/s)
Drilling edge breakage <0.5(mm)
Note: Platform size can be customized.

 

 


Infrared Nanosecond Laser Drilling Equipment Large-Format For Glass Substrates 0

Working Principle

 


1. Laser Generation: The system employs laser sources (e.g., Nd:YAG or fiber lasers) to generate infrared light at 1064 nm wavelength with nanosecond-scale pulse durations (1ns = 10ns).

 

2. Energy Focusing: The laser beam is concentrated into micron-scale spots via optical systems (e.g., galvanometers and F-θ lenses), achieving extremely high energy density (up to GW/cm² level).

 

3. Material Interaction: Nanosecond pulsed lasers interact with glass through photothermal and photomechanical effects:

 

· Photothermal Effect: Laser energy absorption induces localized heating, causing material melting or vaporization.

· Photomechanical Effect: Short pulses generate shockwaves that produce micro-explosive fractures, forming cavities.

 

4. Layer-by-Layer Removal: Controlled pulse counts and scanning paths enable precise material ablation, creating high-accuracy holes.

 

 


 

Technical Features

 

 

1. High Precision: Hole diameters of 20-500 μm, depths up to several millimeters, with wall roughness (Ra) <1 μm.

 

2. Non-Contact Processing: Eliminates mechanical stress, ideal for brittle glass (e.g., quartz, borosilicate).

 

3. Controlled Thermal Impact: Nanosecond pulses minimize heat diffusion, preventing edge cracks (vs. millisecond lasers).

 

4. High Flexibility: Capable of forming complex geometries (round, square, tapered holes) and micro-hole arrays.

 

 


 

Process Applications


Suitable for drilling, grooving, film removal, and surface texturing of brittle/hard materials, including:

 

 

1. Drilling and notching for shower door panels;

2. Hole drilling for appliance glass;

3. Solar panel perforation;

4. Switch/socket cover drilling;

5. Mirror film removal and drilling;

6. Custom grooving and surface texturing;

 

 

Advantages

 

1. Large-format platform accommodates diverse product sizes across industries.

2. Complex hole geometries achieved in single-step processing.

3. Minimal edge chipping with smooth machined surfaces.

4. Seamless transition between product specifications; user-friendly operation.

5. Low operating costs, high yield, no consumables, and pollution-free.

6. Non-contact processing prevents surface scratches.

 

 

Infrared Nanosecond Laser Drilling Equipment Large-Format For Glass Substrates 1Infrared Nanosecond Laser Drilling Equipment Large-Format For Glass Substrates 2

 

 


 

 

Machining effect——Sample display

 

 

 Infrared Nanosecond Laser Drilling Equipment Large-Format For Glass Substrates 3

 

 


 

Q&A​

 

 

1. Q: How does a nanosecond laser drill glass?
     A: It uses 1064nm infrared pulses (1-100ns) to melt/vaporize glass with minimal heat damage, creating precise 20-500μm holes.

 

 

2. Q: Why choose nanosecond lasers for glass drilling?
     A: Key benefits: No cracking (low heat),  High speed (100+ holes/sec), Works on brittle materials,No tool wear.

 

 


Tag: #Infrared Nanosecond Laser Drilling equipment, #Large-Format, #Glass Substrates