8inch SiC crystal ingot Thinning
8-inch Wafer Thinning System is a high-precision equipment specifically designed for semiconductor manufacturing. Utilizing advanced grinding and polishing technologies, it enables precision thinning of wafers made of silicon, silicon carbide (SiC), gallium nitride (GaN) and other materials. The system features automatic thickness control (±1μm accuracy), in-situ inspection, and stress relief functions, capable of thinning 8-inch (200mm) wafers from initial thickness down to below 50μm while maintaining TTV (Total Thickness Variation) ≤2μm. It meets stringent process requirements for advanced packaging and power devices, and is particularly suitable for high-end applications including TSV and 3D IC processes, offering high efficiency and low-damage processing characteristics.
8inch
SiC crystal ingot Thinning
SiC wafer
Sapphire wafer
Silicon wafer
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Sapphire Wafer C-Plane to M 1°off 99.999% Al2O3 Dia 2"3"4"6"8" customize orientation
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Sapphire Wafer C-Plane to A 1°off 99.999% Al2O3 Dia 2"3"4"6"8" customize thickness
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Sapphire Wafer C-Plane to A 0.2±0.1°off 99.999% Al2O3 Dia 50.8 Thickness 430um DSP SSP
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Sapphire Tube length 203.2 mm Pressure Resistant Customized Size Single Crystal Al2O3
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Sapphire Tube length 50.8 mm Pressure Resistant Customized Size Single Crystal Al2O3
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