TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via (TGV)
The TGV sapphire wafer with laser-drilled apertures is an advanced substrate material fabricated by forming high-precision through-glass vias (TGV) on single-crystal sapphire (Al₂O₃) substrates via laser or etching processes. It combines sapphire’s exceptional hardness, high-temperature resistance, and optical transparency with TGV’s micro/nano-structuring capabilities.
TGV glass
TGV
TGV Sapphire Wafer Perforated Glass Substrate
JGS1
JGS2
BF33
Sapphire
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TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized
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Premium 40mm/42mm Round Sapphire Crystal Watch Case Scratch-Resistant Customizable Purple
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Customizable 40mm/42mm Round Sapphire Watch Case In Magenta
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Through Glass Vias (TGV) For JGS1 JGS2 Sapphire Corning Glass Eligible For Any Metalization Process
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Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions
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