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SHANGHAI FAMOUS TRADE CO.,LTD
Mail: eric_wang@zmsh-materials.com TEL: 86-1580-1942596
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Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions
  • Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions
  • Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions
  • Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions

Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions

Place of Origin Shanghai China
Brand Name ZMSH
Certification ROHS
Model Number Through Glass Vi (TGV)
Product Details
Material:
JGS1 JGS2 BF33 Sapphire Corning
Size:
Customizable
Diameter:
Customizable
Thickness:
0.1mmt~0.5mmt
Super Smooth Sidewalls:
RA < 0,08 µm
High Light: 
Through Glass Vias JGS1 JGS2, JGS1 JGS2 Sapphire BF33 Quartz
Product Description

Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions

Product introduction

Our company specializes in the production of Through Glass Via (TGV) wafers that are specifically designed for metallizing microholes. These TGV wafers are customized in terms of size and design to suit your specific requirements, making them compatible with any metalization process you utilize.

We take pride in offering TGV microhole wafers with high surface quality. Our wafers are manufactured to stringent standards, ensuring a smooth and uniform surface that minimizes the need for extensive post-processing. This saves valuable time and resources in your production process, enabling a more efficient and streamlined workflow.

Our TGV glass wafers are densely packed with through holes, providing precise and reliable connectivity between different layers or components within your devices. These microholes are strategically positioned and fabricated to accommodate your unique design needs, ensuring optimal performance and functionality.

In addition to our high-quality products, we also provide rapid prototyping and production services for your individual designs. Whether you require a small batch for prototyping or a large-scale production run, we have the capabilities and expertise to meet your needs. Our team is committed to delivering exceptional customer service and supporting you throughout the entire process.

With our TGV wafers, you can expect superior quality, reliable performance, and efficient production for your microhole metallization applications. We are dedicated to partnering with you and providing tailored solutions to help you achieve your goals.

Product parameter

Specification Value
Glass Thickness <1.1 mm
Wafer Sizes All standard up to 200 mm
Minimum Microhole Diameter 10 µm
Identical Hole Diameter 99%
Positional Accuracy ±3 µm
Chipping None
Super Smooth Sidewalls RA < 0.08 µm
Hole Types Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse)
Hole Shape Hourglass
Option Singulation from hole-processed large-sized glass

Product details display

Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions 0Through Glass Vi (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions 1

Product advantage

Material Diversity: Our TGV offerings are crafted from high-quality materials including JGS1 and JGS2 glasses, known for their exceptional optical clarity and thermal stability; sapphire, which provides outstanding hardness and scratch resistance; BF33 glass, renowned for its thermal and mechanical properties; and quartz, appreciated for its high purity and chemical resistance.

Customization: We provide fully customizable dimensions tailored to client specifications, ensuring optimal integration with existing systems. The thickness of our TGV products can be as low as 100 µm, accommodating ultra-thin applications and enhancing device compactness.

Enhanced Performance: The use of superior materials like sapphire and quartz in TGV technology significantly improves device performance by enhancing thermal management and reducing signal losses. This leads to more efficient operation and prolonged device life.

Reliability and Durability: Our TGV products are engineered to withstand harsh conditions, making them suitable for use in high-reliability sectors such as aerospace, military, and medical devices. The resilience of materials like sapphire and JGS glass ensures long-term reliability and performance under extreme environmental conditions.

Technological Superiority: Incorporating advanced TGV technology enhances the electrical performance by providing a direct pathway for signal and power transmission through the substrate, which minimizes impedance and increases the speed of electronic devices.

Market Flexibility: Suitable for a wide range of applications from consumer electronics to specialized industrial equipment, our TGV products are versatile and adaptable to both mass-market and niche technological needs.

Our advanced TGV technology, coupled with our commitment to customization and quality, makes us a leader in the field, ready to meet the evolving challenges of modern industries. Choose our TGV solutions for unparalleled performance and reliability.

Contact Us at Any Time

86-1580-1942596
Rm5-616,No.851,Dianshanhu avenue, Qingpu area,Shanghai city,CHINA
Send your inquiry directly to us