Video Channel of China SHANGHAI FAMOUS TRADE CO.,LTD
Chat Now Contact Us
Home Videos Playlist Website

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding

Other Videos
April 15, 2025
Category Connection: Semiconductor Equipment
Chat Now Contact Us
This system is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. The system incorporates advanced room-temperature direct bonding and surface-activated bonding technologies, with special optimization for SiC-SiC and SiC-Si heterogeneous bonding processes.
Tags:
#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the advanced Wafer Bonding Equipment designed for room temperature and hydrophilic bonding of Si-SiC and Si-Si wafers ranging from 2 to 12 inches. This high-end system features ultra-high precision optical alignment, closed-loop temperature/pressure control, and supports various bonding processes for power semiconductor device fabrication.
Related Product Features:
  • Supports direct bonding and plasma-activated bonding for 2"-12" wafers.
  • Ultra-high precision optical alignment with ≤±0.5 μm accuracy.
  • Precision adjustable pressure control ranging from 0-10 MPa.
  • Temperature range from RT-500°C with optional preheat/annealing module.
  • Ultra-high vacuum environment (≤5×10⁻⁶ Torr) for contaminant-free bonding.
  • Industrial-grade touch HMI with ≥50 stored process recipes.
  • Triple interlock protection for safety (pressure/temperature/vacuum).
  • Optional robotic wafer handling and SECS/GEM communication protocol support.
Faqs:
  • What are the advantages of room-temperature wafer bonding compared to thermal bonding?
    Room-temperature bonding prevents thermal stress and material degradation, enabling direct bonding of dissimilar materials (e.g., SiC-LiNbO₃) without high-temperature limitations.
  • Which materials can be bonded using room-temperature wafer bonding technology?
    It supports bonding of semiconductors (Si, SiC, GaN), oxides (LiNbO₃, SiO₂), and metals (Cu, Au), ideal for MEMS, 3D ICs, and optoelectronic integration.
  • What applications is the Wafer Bonding Equipment suitable for?
    It is ideal for MEMS device packaging, CIS image sensors, 3D IC integration, compound semiconductor devices, and biochip fabrication.
Related Videos
Ruby Bearings Al₂O₃ Single Crystal for Precision Instruments and Meters 00:15

Ruby Bearings Al₂O₃ Single Crystal for Precision Instruments and Meters
Other Videos
August 26, 2025
Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials Processing 00:17

Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials Processing
Other Videos
August 14, 2025
SiC Substrate Laser Separation System Machine 00:27

SiC Substrate Laser Separation System Machine
Other Videos
July 15, 2025
Sapphire Light Cones 00:25

Sapphire Light Cones
sapphire glass
July 09, 2025
Microfluidic laser equipment for semiconductor wafer processing 00:16

Microfluidic laser equipment for semiconductor wafer processing
Other Videos
April 02, 2025
Ruby Laser Rod / ruby sapphire/color sapphire for watch case/blue sapphire crystal 00:28

Ruby Laser Rod / ruby sapphire/color sapphire for watch case/blue sapphire crystal
color doped sapphire
September 09, 2022
Custom Sapphire Optical Glass Domes for Monitoring Window Protection 00:09

Custom Sapphire Optical Glass Domes for Monitoring Window Protection
sapphire glass
August 27, 2025
Multi-Wire Saw Cutting Machine for Natural Stone Processing 00:36

Multi-Wire Saw Cutting Machine for Natural Stone Processing
Other Videos
August 21, 2025
CO₂ Laser Cutting Machine 00:30

CO₂ Laser Cutting Machine
Other Videos
July 07, 2025
Wafer Thinning Equipment 00:51

Wafer Thinning Equipment

Other Videos
April 15, 2025