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Fully Automatic Precision Dicing Saw equipment for 8inch 12inch Wafer Cutting

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April 29, 2025
Category Connection: Semiconductor Equipment
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The fully automatic precision dicing saw is an advanced semiconductor cutting system designed for high-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level cutting accuracy (±2μm) with minimal chipping (<5μm), outperforming alternative methods in semiconductor and advanced packaging applications. The system integrates high-rigidity spindles, nanometric positioning stages, and intelligent vision alignment for unmanned operation, meeting the stringent requirements of modern chip manufacturing and third-generation semiconductor processing.
Tags:
#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the Fully Automatic Precision Dicing Saw Equipment for 8inch and 12inch wafer cutting. This advanced semiconductor cutting system offers micron-level accuracy (±2μm) with minimal chipping, ideal for high-precision separation of wafers and brittle materials. Perfect for modern chip manufacturing and third-generation semiconductor processing.
Related Product Features:
  • High-speed cassette frame scanning with collision prevention alert system for rapid precision positioning.
  • Innovative dual-spindle synchronous cutting mode increases processing efficiency by 80%.
  • Premium imported ball screws and linear guides ensure long-term machining stability.
  • Fully automated operation reduces manual intervention with loading, positioning, cutting, and inspection.
  • High-precision non-contact height measurement system for accurate cuts.
  • Multi-wafer simultaneous dual-blade cutting capability for efficient processing.
  • Intelligent detection systems including auto-calibration, cut mark inspection, and blade breakage monitoring.
  • Customizable factory automation module integration for diverse cutting requirements.
Faqs:
  • What is a fully automatic precision dicing saw used for?
    It's for high-accuracy cutting of semiconductors (silicon, SiC), ceramics, and fragile materials like glass wafers, achieving micron-level precision with minimal damage.
  • How does automatic dicing improve semiconductor production?
    Key benefits include 99.9% yield with ±2μm accuracy, 50% faster than manual operation, cuts ultra-thin wafers (<50μm), and zero tool contamination.
  • What materials can the Fully Automatic Precision Dicing Saw Equipment process?
    It can process materials like Aluminum Nitride (AlN), PZT Ceramic, Bismuth Telluride (Bi₂Te₃), Monocrystalline Silicon (Si), Epoxy Molding Compound, and Cu Pillars/PI Dielectric.
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