Video Channel of China SHANGHAI FAMOUS TRADE CO.,LTD
Chat Now Contact Us
Home Videos Playlist Website

Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic Material Processing

Other Videos
August 14, 2025
Category Connection: Semiconductor Equipment
Chat Now Contact Us
The diamond wire single-line cutting machine is a high-precision processing equipment for hard and brittle materials, utilizing diamond-impregnated wire (diamond wire) as the cutting medium to achieve efficient and low-loss cutting through high-speed reciprocating motion. This machine is primarily designed for processing hard and brittle materials such as sapphire, silicon carbide (SiC), quartz, glass, silicon rods, jade, and ceramics, including operations like cropping, truncation, cutting-off, and slicing—especially suitable for precision cutting of high-hardness and large-sized materials.
Tags:
#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the Diamond Wire Single-Line Cutting Machine, designed for high-precision processing of hard and brittle materials like SiC, sapphire, quartz, and ceramics. This advanced machine offers efficient, low-loss cutting with superior surface quality, ideal for industries such as semiconductors, photovoltaics, and precision optics.
Related Product Features:
  • High-efficiency processing with a maximum wire speed of 1500 m/min for ultra-hard materials like SiC and sapphire.
  • Intelligent operation featuring a user-friendly touchscreen interface for easy parameter storage and recall.
  • Modular design with optional rotary worktable and high-tension system for versatile cutting needs.
  • Robust structural design with high-strength cast/forged machine body for long-term stability and accuracy.
  • Precision feeding system ensures dimensional accuracy up to ±0.02 mm.
  • Cooling and debris removal system reduces thermal impact and prevents edge chipping.
  • Supports automatic tool alignment and vision positioning for complex-shape processing.
  • Widely applicable in semiconductor, photovoltaic, precision optics, and jewelry industries.
Faqs:
  • What materials can be cut with a diamond wire saw?
    Diamond wire saws excel at cutting hard brittle materials including silicon carbide (SiC), sapphire, quartz, ceramics, and semiconductor crystals with precision up to ±0.02mm.
  • How does diamond wire cutting compare to laser cutting for SiC wafers?
    Diamond wire cutting achieves 50% faster processing of SiC with <100μm material loss versus laser's thermal damage risk and higher kerf loss.
  • What are the key advantages of using a diamond wire single-line cutting machine?
    The machine offers high efficiency, precision, low material loss, and superior surface quality, making it ideal for industries like semiconductors, photovoltaics, and precision optics.
Related Videos
High-Precision Chromatic Laser Processing Equipment 00:29

High-Precision Chromatic Laser Processing Equipment
Other Videos
August 15, 2025
Chromatic Laser Processing Equipment for Stainless Steel/Glass/Ceramic Materials 00:26

Chromatic Laser Processing Equipment for Stainless Steel/Glass/Ceramic Materials
Other Videos
August 15, 2025
​​High-Precision Single-Side Polishing Equipment 00:21

​​High-Precision Single-Side Polishing Equipment
Other Videos
August 15, 2025
​​High-Precision Double-Sided Grinding/Polishing Equipment 00:07

​​High-Precision Double-Sided Grinding/Polishing Equipment
Other Videos
August 15, 2025
Double-Sided Precision Grinding Machine for Metals/Non-Metals/Ceramics/Plastics 00:09

Double-Sided Precision Grinding Machine for Metals/Non-Metals/Ceramics/Plastics
Other Videos
August 15, 2025
12 inch sapphire wafer 00:26

12 inch sapphire wafer
Other Videos
March 31, 2023
12inch Diameter 300mm 1.0mm Double Side Polished Sapphire Wafers 00:26

12inch Diameter 300mm 1.0mm Double Side Polished Sapphire Wafers
sapphire glass
October 10, 2022
Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials Processing 00:17

Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials Processing
Other Videos
August 14, 2025
4inch 6inch 8inch 12inch DSP sapphire wafers Made in CHINA 00:29

4inch 6inch 8inch 12inch DSP sapphire wafers Made in CHINA
sapphire glass
September 08, 2022
TGV（Through-Glass Via ）borosilicate glass quartz 00:49

TGV（Through-Glass Via ）borosilicate glass quartz
TGV glass
May 29, 2024