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Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials Processing

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August 14, 2025
Category Connection: Semiconductor Equipment
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The multi-wire diamond saw cutting machine is a high-efficiency, precision slicing equipment specifically designed for ultra-hard and brittle materials. It employs parallel cutting technology using multiple diamond-impregnated wires to simultaneously process multiple workpieces. This machine is primarily used for high-speed, high-efficiency, and high-precision multi-wafer cutting of materials such as silicon carbide (SiC), gallium nitride (GaN), sapphire, quartz, and ceramics, making it ideal for mass production in semiconductor, photovoltaic, and LED industries.
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#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the high-efficiency Multi-Wire Diamond Saw Cutting Machine, designed for precision slicing of ultra-hard materials like SiC, sapphire, and ceramics. Ideal for semiconductor, photovoltaic, and LED industries, this machine boosts productivity with parallel cutting technology and exceptional accuracy.
Related Product Features:
  • High-efficiency slicing with parallel cutting technology for ultra-hard materials.
  • Precision cutting accuracy of ±0.02 mm and surface quality Ra <0.5 μm.
  • Modular design supports automatic loading, tension adjustment, and intelligent monitoring.
  • Maximum cutting speed of 1500 m/min for high-throughput production.
  • Equipped with B&R servo drives for real-time dynamic adjustments.
  • Supports wire diameter switching (φ0.12-0.45 mm) for versatile processing.
  • Industrial-grade reliability with high-strength cast/forged frame.
  • Ideal for semiconductor, photovoltaic, LED, and advanced ceramics industries.
Faqs:
  • What is the maximum cutting speed of the Multi-Wire Diamond Saw Cutting Machine?
    The machine achieves cutting speeds up to 1500 m/min with precision within ±0.02 mm.
  • How does the multi-wire system compare to single-wire cutting machines?
    Multi-wire systems cut 50-200 wafers per run, offering 5-10x higher productivity than single-wire systems.
  • What materials can the Multi-Wire Diamond Saw Cutting Machine process?
    It is designed for ultra-hard materials like silicon carbide (SiC), gallium nitride (GaN), sapphire, quartz, and ceramics.
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