Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials Processing

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August 13, 2025
Keyword: Wire Saw Machine
Video Description:
Discover the high-efficiency Multi-Wire Diamond Saw Cutting Machine, designed for precision slicing of ultra-hard materials like SiC, sapphire, and ceramics. Ideal for semiconductor, photovoltaic, and LED industries, this machine boosts productivity with parallel cutting technology and exceptional accuracy.