​​High-Precision Double-Sided Grinding/Polishing Equipment

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August 14, 2025
Video Description:
Discover the High-Precision Double-Sided Grinding/Polishing Equipment, designed for hard-brittle materials like sapphire, glass, and quartz. Achieve ultra-precise results with planarity ≤ 0.6 μm and roughness Ra ≤ 0.4 nm. Ideal for semiconductor, optoelectronics, and aerospace industries.