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​​High-Precision Double-Sided Grinding/Polishing Equipment

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August 15, 2025
Category Connection: Semiconductor Equipment
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High-precision double-sided grinding/polishing equipment is a specialized precision machining device designed for hard-brittle materials such as semiconductor wafers, sapphire substrates, optical glass, quartz crystals, ceramics, and metals. By employing dual grinding plates rotating in opposite directions and a planetary motion mechanism, the equipment achieves simultaneous double-sided grinding and polishing, ensuring high planarity (TTV ≤ 0.6 μm), low roughness (Ra ≤ 0.4 nm), and high parallelism (≤ 2 μm). It is widely applied in semiconductor manufacturing, optoelectronics, precision machinery, and aerospace industries, addressing applications like silicon wafer thinning, optical component mirror finishing, and ceramic sealing ring precision grinding, thereby significantly enhancing processing efficiency and yield.
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#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the High-Precision Double-Sided Grinding/Polishing Equipment, designed for hard-brittle materials like sapphire, glass, and quartz. Achieve ultra-precise results with planarity ≤ 0.6 μm and roughness Ra ≤ 0.4 nm. Ideal for semiconductor, optoelectronics, and aerospace industries.
Related Product Features:
  • Specialized for hard-brittle materials including sapphire, glass, quartz, and semiconductor wafers.
  • Achieves high planarity (TTV ≤ 0.6 μm) and low roughness (Ra ≤ 0.4 nm).
  • Features dual grinding plates rotating in opposite directions for uniform processing.
  • Planetary motion mechanism ensures synchronous contact with both plates.
  • Closed-loop pressure control (0-1,000 kg adjustable) prevents material fracture.
  • Water/oil cooling systems maintain constant temperature (10-25°C).
  • Core components from international brands like SEW, THK, and SKF.
  • 7-inch touchscreen HMI for preset grinding recipes and real-time monitoring.
Faqs:
  • What materials are suitable for high-precision double-sided grinding/polishing machines?
    Specifically designed for hard and brittle materials such as sapphire, optical glass, quartz crystals, ceramics, semiconductor silicon wafers, and metals, supporting simultaneous double-sided ultra-precision processing.
  • What precision levels can double-sided grinding machines achieve?
    Flatness ≤2 μm, surface roughness Ra <0.4 nm, thickness tolerance ±0.5 μm, meeting high-end requirements for semiconductor wafers and optical components.
  • What industries benefit from this equipment?
    Widely applied in semiconductor manufacturing, optoelectronics, precision machinery, and aerospace industries for applications like silicon wafer thinning, optical component mirror finishing, and ceramic sealing ring precision grinding.
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