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​​High-Precision Single-Side Polishing Equipment

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August 15, 2025
Category Connection: Semiconductor Equipment
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#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the High-Precision Single-Side Polishing Equipment, designed for Si Wafers, SiC, and Sapphire Materials. Achieve ultra-high surface finishing with flatness ≤0.01 mm and roughness Ra ≤0.4 nm. Ideal for semiconductor, optical, and ceramic applications.
Related Product Features:
  • Specialized for hard and brittle materials like silicon wafers, silicon carbide, and sapphire.
  • Achieves ultra-high surface finishing with flatness ≤0.01 mm and roughness Ra ≤0.4 nm.
  • Supports both single-piece and batch processing for enhanced efficiency.
  • Features a high-rigidity frame with integrated casting-forging structure for stability.
  • Uses international components like Germany SEW and Japan THK for precision.
  • 10-inch industrial touchscreen for preset recipes and real-time monitoring.
  • Flexible configuration with polishing disc sizes from φ300 mm to φ1900 mm.
  • Widely used in semiconductor, optics, electronics, and aerospace industries.
Faqs:
  • What are the key advantages of your high-precision single-side polishing equipment?
    Achieves sub-micron precision with high efficiency, ideal for silicon wafers, SiC, and sapphire in semiconductor manufacturing.
  • Which semiconductor materials can this single-side polishing machine process?
    Specifically designed for silicon wafers, silicon carbide (SiC), and sapphire substrates.
  • What industries benefit from this polishing equipment?
    Semiconductor, optics, electronics, and aerospace industries benefit from its precision and versatility.
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