​​High-Precision Single-Side Polishing Equipment

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August 14, 2025
Video Description:
Discover the High-Precision Single-Side Polishing Equipment, designed for Si Wafers, SiC, and Sapphire Materials. Achieve ultra-high surface finishing with flatness ≤0.01 mm and roughness Ra ≤0.4 nm. Ideal for semiconductor, optical, and ceramic applications.