Vertical/Horizontal/Multi-Wire Cutting​​ ​​Wire Saw Equipment for Sapphire/Ceramics/Marble

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October 11, 2025
Category Connection: Semiconductor Equipment
Brief: Discover the advanced Wire Saw Equipment for Vertical, Horizontal, and Multi-Wire Cutting of Sapphire, Ceramics, and Marble. This high-precision tool uses diamond-coated wires for efficient, low-damage cutting, enhancing material utilization and processing speed for hard and brittle materials.
Related Product Features:
  • High-speed diamond wire cutting for precision and efficiency.
  • Suitable for sapphire, ceramics, and marble with minimal material loss.
  • Vertical, horizontal, and multi-wire cutting options for versatile applications.
  • Achieves surface roughness as low as Ra<0.5μm for sapphire.
  • Automated control with CNC or PLC systems for consistent performance.
  • Customizable parameters based on material hardness and size.
  • Environmentally friendly with reduced waste and energy consumption.
  • Integrated service including technical training and full-cycle support.
Faqs:
  • How does the wire saw equipment achieve precise cutting?
    The equipment uses a high-speed diamond-coated wire that acts as a flexible grinding tool, maintaining minimal kerf loss and high accuracy through controlled tension and linear motion.
  • What materials can this wire saw equipment process?
    It is designed for hard and brittle materials such as sapphire, ceramics, and marble, offering high-precision cutting with minimal damage.
  • What are the benefits of multi-wire cutting?
    Multi-wire cutting allows simultaneous slicing of multiple pieces from a single block, significantly improving efficiency for large-scale projects or uniform component production.