Brief: Discover the 6-inch JGS2 Wafer Quartz Substrate DSP 1mmt, a high-performance fused silica solution for precision optical applications. Ideal for UV to near-infrared wavelengths, this double-side polished wafer offers exceptional thermal stability and mechanical strength.
Related Product Features:
6-inch diameter JGS2 quartz wafer with 1mm thickness for high-precision applications.
Double-side polished (DSP) surface for nanoscale roughness and superior optical clarity.
UV-grade fused silica with broad spectral transmittance from 220 nm to 2500 nm.
Extremely low coefficient of thermal expansion (~5.5×10⁻⁷/°C) for dimensional stability.
High Mohs hardness (~7) and Young's Modulus (~72 GPa) for mechanical durability.
Ideal for semiconductor photolithography, optical filters, and photonic communication devices.
Resistant to harsh environments, including high temperatures and corrosive conditions.
Softening point above 1600°C, ensuring reliability in extreme thermal processes.
Faqs:
What makes the 6-inch JGS2 DSP wafer suitable for UV optical applications?
Its exceptional UV transmittance down to 220 nm and low thermal expansion coefficient ensure minimal distortion under high-power UV exposure, making it ideal for semiconductor lithography and laser systems.
How does the 1 mm thickness benefit high-precision optical systems?
The 1 mm thickness provides an optimal balance between mechanical strength and optical flatness, crucial for maintaining beam coherence and reducing wavefront distortion in precision optics.
What are the primary applications of the 6-inch JGS2 wafer?
It is widely used in semiconductor processes, optical component manufacturing, and photonic communication devices, such as DWDM filter systems, due to its high purity and thermal stability.