Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing

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January 06, 2026
Category Connection: Semiconductor Equipment
Brief: Stay tuned as we highlight the most important features and real-use results. In this video, we demonstrate the ZMSH Wafer Mounting Ring, a 420 stainless steel frame for semiconductor dicing. You'll see how its precision engineering ensures secure wafer handling, minimizes vibration, and improves yield during high-precision processes like back grinding and bonding.
Related Product Features:
  • Made from 420 stainless steel with high hardness and wear resistance for long-lasting performance.
  • Excellent flatness and rigidity ensure stability during high-speed, high-precision dicing operations.
  • Stable performance under repeated cleaning and reuse cycles, offering a cost-effective solution.
  • Smooth surface finish is compatible with cleanroom environments and prevents contamination.
  • Suitable for both manual and automated wafer handling systems, enhancing operational flexibility.
  • Customizable dimensions, thickness, and edge design available to meet specific application needs.
  • Reusable with professional cleaning and refurbishment processes, reducing long-term costs.
  • Compatible with dicing tape and UV tape for reliable wafer fixation in various semiconductor processes.
FAQs:
  • What materials are used in the ZMSH Wafer Mounting Ring?
    The ZMSH Wafer Mounting Ring is manufactured from 420 stainless steel, which provides excellent rigidity, flatness, and dimensional stability, along with high hardness and wear resistance for reliable performance in semiconductor processing.
  • Is the wafer mounting ring reusable?
    Yes, the ZMSH wafer mounting ring is designed for reuse and is compatible with professional cleaning and refurbishment processes, making it a cost-effective solution for wafer fabs, OSATs, and laboratories.
  • What sizes and customizations are available for the wafer mounting ring?
    Standard sizes include 6", 8", and 12" with specific thicknesses and flatness tolerances. Customizable dimensions, thickness, edge design, and surface finishes are available based on customer drawings or samples.
  • In which semiconductor processes can the wafer mounting ring be used?
    It is widely used in semiconductor wafer dicing, back grinding, thinning, film mounting with blue or UV tape, die attach, bonding processes, LED and power semiconductor packaging, and temporary wafer holding and transportation.