Product Details
Place of Origin: China
Brand Name: ZMSH
Certification: ROHS
Payment & Shipping Terms
Delivery Time: 2-4weeks
Payment Terms: T/T
PL Wavelength Control: |
Better Than 3nm |
PL Wavelength Uniformity: |
Std.Dev Better Than 1nm @inner 42mm |
Thickness Control: |
Better Than +3% |
Thickness Uniformity: |
Better Than +3% @inner 42mm |
Doping Control: |
Better Than +10% |
P-InP Doping (cm-3) N-InP Doping (cm-3): |
Si Doped; 5e17 To 3e18 |
PL Wavelength Control: |
Better Than 3nm |
PL Wavelength Uniformity: |
Std.Dev Better Than 1nm @inner 42mm |
Thickness Control: |
Better Than +3% |
Thickness Uniformity: |
Better Than +3% @inner 42mm |
Doping Control: |
Better Than +10% |
P-InP Doping (cm-3) N-InP Doping (cm-3): |
Si Doped; 5e17 To 3e18 |
FP epiwafer InP substrate contact layer InGaAsP Dia 2 3 4 inch for OCT 1.3um wavelength band
FP epiwafer InP substrate's Brief
Fabry-Perot (FP) epiwafers on Indium Phosphide (InP) substrates are key components in the development of optoelectronic devices, particularly laser diodes used in optical communication and sensing applications. InP substrates provide an ideal platform due to their high electron mobility, direct bandgap, and excellent lattice matching for epitaxial growth. These wafers typically feature multiple epitaxial layers, such as InGaAsP, that form the FP laser cavity and are designed to emit light in the critical 1.3 μm to 1.55 μm wavelength bands, making them highly effective for fiber-optic communication.
FP lasers, grown on these epiwafers, are known for their relatively simple structure compared to other laser types, like Distributed Feedback (DFB) lasers, which makes them a cost-effective solution for many applications. These lasers are widely used in short-to-medium range optical communication systems, data center interconnects, and sensing technologies such as gas detection and medical diagnostics.
InP-based FP epiwafers provide flexibility in wavelength selection, good performance, and lower production costs, making them a vital component in the growing fields of telecommunications, environmental monitoring, and integrated photonic circuits.
FP epiwafer InP substrate's data sheet
FP epiwafer InP substrate's diagram
FP epiwafer InP substrate's properties
InP Substrate
Epitaxial Layers
Optical Properties
Cost-Effectiveness
These properties make FP epiwafers on InP substrates highly suitable for use in optical communication systems, sensing devices, and photonic integrated circuits.
Property | Description |
Crystal Structure | Zinc-blende crystal structure |
Lattice Constant | 5.869 Å - Matches well with InGaAs and InGaAsP, minimizing defects |
Bandgap | 1.344 eV at 300 K, corresponding to ~0.92 μm emission wavelength |
Epiwafer Emission Range | Typically in the 1.3 μm to 1.55 μm range, suitable for optical communication |
High Electron Mobility | 5400 cm²/V·s, enabling high-speed, high-frequency device applications |
Thermal Conductivity | 0.68 W/cm·K at room temperature, provides adequate heat dissipation |
Optical Transparency | Transparent above its bandgap, allowing efficient photon emission in the IR range |
Doping and Conductivity | Can be doped as n-type (sulfur) or p-type (zinc), supports ohmic contacts |
Low Defect Density | Low defect density, improves efficiency, longevity, and reliability of devices |
FP epiwafer InP substrate's application
Fiber Optic Communication
Data Center Interconnects
Optical Sensing
Medical Diagnostics
FP epiwafer InP substrate's photos
Q&A
What is EPI in wafer?
EPI in wafer technology stands for Epitaxy, which refers to the process of depositing a thin layer of crystalline material (epitaxial layer) onto a semiconductor substrate (such as silicon or InP). This epitaxial layer has the same crystallographic structure as the underlying substrate, allowing for high-quality, defect-free growth that is essential for the fabrication of advanced semiconductor devices.
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