Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting

Abstract

Fully Automatic Precision Dicing Saw equipment for 8inch 12inch Wafer Cutting

The fully automatic precision dicing saw is an advanced semiconductor cutting system designed for high-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level cutting accuracy (±2μm) with minimal chipping (<5μm), outperforming alternative methods in semiconductor and advanced packaging applications. The system integrates high-rigidity spindles, nanometric positioning stages, and intelligent vision alignment for unmanned operation, meeting the stringent requirements of modern chip manufacturing and third-generation semiconductor processing.

Technical parameters

Advantages

1. High-speed cassette frame scanning with collision prevention alert system enables rapid precision positioning and superior error correction capability;

2. Innovative dual-spindle synchronous cutting mode increases processing efficiency by 80% compared to single-spindle systems;

3. Premium imported ball screws, linear guides, and Y-axis grating closed-loop control ensure long-term machining stability;

4. Fully automated operation (loading/positioning/cutting/inspection) significantly reduces manual intervention;

5. Unique gantry-style dual-spindle design with minimum 24mm blade spacing accommodates diverse cutting requirements;

Features

1. High-precision non-contact height measurement system;

2. Multi-wafer simultaneous dual-blade cutting capability;

3. Intelligent detection systems (auto-calibration/cut mark inspection/blade breakage monitoring);

4. Multi-mode alignment algorithms adaptable to various process requirements;

5. Real-time position monitoring with automatic error correction;

6. First-cut quality verification mechanism;

7. Customizable factory automation module integration;

Adaptation materials and applications

Machining effect