Diamond Wire Cutting Machine – High-Speed for Hard Materials

Product Description:

Diamond Wire Cutting Machine is specifically designed to meet the multi-wire slicing needs for hard and brittle materials. This advanced cutting solution is widely applicable for the cutting of large-sized and ultra-thin slices of materials such as silicon carbide, sapphire, ceramics, precious metals, quartz, semiconductor materials, optical glass, and laminated glass.

It features a swinging downward cutting mechanism, where the material sways from top to bottom while the diamond wire remains stationary. This design enhances the precision and stability of the cutting process. It is equipped with a fully servo motor system and stable tension control, ensuring high operational accuracy and stability. The diamond wire can operate at speeds of up to 2000 meters per minute, ensuring efficient cutting and significantly boosting production capacity.

The cutting thickness range is from 0.1mm to 20mm, making it suitable for a wide variety of applications across different industries. With its high-speed, high-precision capabilities, the TJ2000 is a versatile and robust cutting machine, providing optimal performance for both large-scale and ultra-thin cutting tasks.

Key Features:

• Cutting Method: Swinging downward cutting (diamond wire remains stationary).

• High-Speed Operation: Maximum diamond wire speed of 2000 meters per minute.

• Cutting Thickness Range: From 0.1mm to 20mm, suitable for a variety of materials.

• Precision and Stability: Fully servo motor system with stable tension control, ensuring high cutting accuracy.

• Wide Application: Ideal for cutting silicon carbide, sapphire, ceramics, precious metals, quartz, semiconductor materials, optical glass, and laminated glass.

• High Production Capacity: Efficient cutting process that significantly increases throughput and production capacity.

Technical Specifications:

Applications:

• Semiconductor Manufacturing: High-precision slicing of silicon wafers.

• Solar Cell Production: Ideal for slicing silicon wafers in photovoltaic cells.

• Material Processing: Suitable for cutting other materials such as ceramics, precious metals, and optical glass.

Related Product:

Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​