Dual Workstation Swing-Up Multi-Wire Cutting Machine for Hard & Brittle Materials

Product Overview:

This advanced multi-wire cutting machine is designed to meet the high-precision cutting requirements of hard and brittle materials such as Silicon Carbide (SiC), Sapphire, Ceramics, Precious Metals, Quartz, Semiconductor Materials, Optical Glass, Laminated Glass, and more. It features dual workstations for increased efficiency, making it perfect for high-volume production and large-sized or ultra-thin cutting applications.

The machine utilizes a swing-up cutting method, paired with a full servo motor system and stable tension control to ensure high cutting accuracy and stability. With a diamond wire running speed of up to 1500 meters per minute, it offers fast processing times and significantly improves production capacity. The cutting thickness range of 1.4mm to 50mm accommodates various industry needs, and the cutting accuracy of 0.01mm ensures precise cuts, even for the most demanding applications.

Equipped with a 300L water tank and an efficient cutting fluid system, this machine guarantees optimal cooling and extends the life of the equipment. The swing angle is adjustable to ±8° with a swing speed of 0.83°/s, providing flexibility for different materials and cutting thicknesses.

This machine is ideal for industries requiring high-volume, high-precision cutting and is suited for semiconductor, optical, aerospace, medical, and other high-precision applications.

Technical Specifications

Applications

This multi-wire cutting machine is ideal for a wide range of industries requiring high-precision cutting of hard and brittle materials. Some of its key applications include:

1. Semiconductor Manufacturing

   • Cutting Silicon Carbide (SiC) and Sapphire for semiconductor wafers.

   • Processing ultra-thin wafers for use in power electronics and other high-performance applications.

2. Optical Glass and Lenses

   • Precision cutting of optical glass for lenses and other optical components.

   • Ensures minimal material loss and high surface quality, crucial for optical precision.

3. Aerospace and Automotive

   • Cutting hard materials like ceramics and metals used in aerospace and automotive components.

   • Suitable for producing parts for electric vehicles, ensuring precision and durability.

4. Medical Device Manufacturing

   • High-precision cutting of ceramic and metal components used in medical devices.

   • Offers accuracy needed for high-end medical applications, such as implants and surgical instruments.

5. Solar Energy Industry

   • Cutting materials such as crystalline silicon for photovoltaic cell production.

   • Ensures high throughput and quality for large-scale solar panel manufacturing.

6. Research & Development (R&D)

   • Suitable for R&D labs cutting a wide variety of materials for experimental purposes.

   • Flexible enough to handle both custom and standard cutting needs.

7. Laminated Glass Processing

   • Ideal for cutting laminated glass used in architectural, automotive, and consumer electronics industries.

   • Delivers precise cuts, ensuring clean edges and reducing material waste.

8. Precious Metals and Jewelry

   • Cutting high-value materials like gold, platinum, and other precious metals for jewelry manufacturing.

   • Ensures precise, clean cuts, preserving the integrity and value of these materials.

9. Ceramics and Hard Materials

   • Ideal for cutting ceramics used in industrial applications.

   • Provides reliable cutting for both thick and thin ceramic parts, minimizing breakage and waste.

With its combination of high-speed cutting, accuracy, and reliability, this machine provides an optimal solution for industries that require both efficiency and high-quality results in the cutting of hard and brittle materials.

Related Products:

Diamond Wire Cutting Machine – High-Speed for Hard Materials