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TGV（Through-Glass Via ）borosilicate glass quartz

TGV glass
May 29, 2024
Category Connection: Ceramic Substrate
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TGV（Through-Glass Via ）borosilicate glass quartz
Tags:
#alumina ceramic substrate #aln ceramic substrate #silicon carbide ceramic
Brief: Discover the revolutionary TGV (Through-Glass Via) technology using high-quality borosilicate glass and quartz. Ideal for advanced packaging in semiconductors, this technology enables 3D integration for optical communications, RF front ends, and more. Learn how TGV offers low-loss, high-density solutions with cost-effective benefits.
Related Product Features:
  • TGV technology enables next-generation 3D integration for semiconductors.
  • Made from high-quality borosilicate glass and fused quartz for reliability.
  • Supports applications in optical communications, RF front ends, and MEMS packaging.
  • Features low substrate loss, high density, and quick response times.
  • Cost-effective compared to traditional silicon-based interposers.
  • Offers excellent electrical, thermal, and mechanical properties.
  • Suitable for millimeter-wave antennas, chip interconnects, and 2.5/3D packaging.
  • Morimaru Electronics provides high aspect ratio (7:1) via filling processes.
Faqs:
  • What is TGV technology used for?
    TGV technology is used for advanced packaging in semiconductors, enabling 3D integration in optical communications, RF front ends, MEMS packaging, and more.
  • What materials are used in TGV technology?
    TGV technology uses high-quality borosilicate glass and fused quartz, offering excellent thermal, mechanical, and chemical stability.
  • How does TGV compare to silicon-based interposers?
    TGV offers lower substrate loss, higher density, quicker response, and lower processing costs compared to traditional silicon-based interposers.
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