TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via (TGV)

TGV glass
April 11, 2025
Category Connection: Sapphire Parts
The TGV sapphire wafer with laser-drilled apertures is an advanced substrate material fabricated by forming high-precision through-glass vias (TGV) on single-crystal sapphire (Al₂O₃) substrates via laser or etching processes. It combines sapphire’s exceptional hardness, high-temperature resistance, and optical transparency with TGV’s micro/nano-structuring capabilities.