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TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via (TGV)

TGV glass
April 11, 2025
Category Connection: Sapphire Parts
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The TGV sapphire wafer with laser-drilled apertures is an advanced substrate material fabricated by forming high-precision through-glass vias (TGV) on single-crystal sapphire (Al₂O₃) substrates via laser or etching processes. It combines sapphire’s exceptional hardness, high-temperature resistance, and optical transparency with TGV’s micro/nano-structuring capabilities.
Tags:
#sapphire tube #sapphire bearings #sapphire windows
Brief: Discover the advanced TGV Sapphire Wafer Perforated Glass Substrate with Through Glass Via (TGV) technology. Perfect for 5G RF filters, GaN power devices, and MEMS applications, these wafers offer high mechanical strength, thermal stability, and precision micro-vias. Customizable for your specific needs.
Related Product Features:
  • High mechanical strength with Mohs hardness of 9, scratch-resistant, and corrosion-resistant.
  • Superior thermal stability, withstands extreme temperatures (>2000°C) with low thermal expansion.
  • Precision through-holes with laser/photolithography enabling micron-scale apertures and high aspect ratios.
  • Excellent optical performance with broadband transparency (80%+ @400-5000nm) from UV to IR wavelengths.
  • Outstanding dielectric properties with resistivity >10¹⁴ Ω*cm for excellent insulation.
  • Available in 2-6" diameters (expandable to 8") with 10-500μm vias and aspect ratios up to 20:1.
  • Supports high-density micro-vias with 10-10,000 vias/cm² and <2° taper angles.
  • Custom solutions include <5μm micro-vias and specialized surface treatments for demanding applications.
Faqs:
  • What are the advantages of sapphire TGV wafers over traditional glass substrates?
    Sapphire TGV wafers offer superior mechanical strength, higher temperature resistance (>2000°C), and better chemical stability compared to standard glass substrates.
  • What applications are sapphire TGV wafers best suited for?
    They are ideal for advanced semiconductor packaging, high-power LED devices, and RF components requiring extreme durability and precision microstructures.
  • Can the TGV sapphire wafers be customized for specific metallization processes?
    Yes, our TGV wafers are tailored to seamlessly integrate with your preferred metallization processes, including electroless plating, sputtering, or electroplating.
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