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Laser microjet cutting (LMJ) equipment

sapphire glass
April 02, 2025
Category Connection: Semiconductor Equipment
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The Microjet Laser system uses the guiding and cooling effects of the liquid jet to couple the high-energy pulsed laser to the micron-scale liquid jet (usually deionized water or inert liquid), enabling ultra-precision machining of semiconductor materials.

Microjet laser technology, with its high precision, low damage and high cleanliness, is replacing traditional machining and dry laser processes in the semiconductor field, especially in third-generation semiconductors (SiC/GaN), 3D packaging and ultra-thin wafer processing.
Tags:
#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the cutting-edge Microjet Laser Technology Equipment designed for ultra-precision wafer slicing of metal and silicon carbide materials. This advanced system combines high-energy pulsed lasers with micron-scale liquid jets for high-precision, low-damage, and high-efficiency processing, ideal for semiconductor and aerospace applications.
Related Product Features:
  • High-precision machining with positioning accuracy of +/-5μm and repeated accuracy of +/-2μm.
  • Ultra-thin wafer processing with cutting widths as narrow as 35μm using a 40μm nozzle.
  • Clean processing with no environmental pollution, utilizing deionized water or inert liquids.
  • Automated processing reduces labor costs and increases efficiency.
  • Suitable for third-generation semiconductors like SiC/GaN, aerospace materials, and ceramic substrates.
  • High processing yield with surface roughness Ra≤1.6um and linear cutting speed ≥50mm/s.
  • Compact design with countertop volumes of 300*300*150mm or 400*400*200mm.
  • Versatile numerical control options including 3 axis, 3+1 axis, and 3+2 axis configurations.
Faqs:
  • What are the main advantages of microjet laser technology equipment?
    The advantages include high-precision processing, excellent cooling effects, no heat-affected zones, parallel cutting edges, and efficient performance, making it ideal for hard and brittle materials.
  • In what fields are microjet laser technology equipment used?
    It is widely used in third-generation semiconductors, aerospace materials, diamond cutting, metallized diamond, ceramic substrates, and other precision machining applications.
  • What is the processing capability of the microjet laser equipment?
    The equipment can achieve surface roughness Ra≤1.6um, opening speeds ≥1.25mm/s, circumference cutting ≥6mm/s, and linear cutting speeds ≥50mm/s, depending on material characteristics.
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