Laser microjet cutting (LMJ) equipment

sapphire glass
April 02, 2025
Video Description:
Discover the cutting-edge Microjet Laser Technology Equipment designed for ultra-precision wafer slicing of metal and silicon carbide materials. This advanced system combines high-energy pulsed lasers with micron-scale liquid jets for high-precision, low-damage, and high-efficiency processing, ideal for semiconductor and aerospace applications.