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Laser microjet cutting (LMJ) equipment

sapphire glass
April 02, 2025
Category Connection: Semiconductor Equipment
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Tags:
#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the cutting-edge Microjet Laser Technology Equipment designed for ultra-precision wafer slicing of metal and silicon carbide materials. This advanced system combines high-energy pulsed lasers with micron-scale liquid jets for high-precision, low-damage, and high-efficiency processing, ideal for semiconductor and aerospace applications.
Related Product Features:
  • High-precision machining with positioning accuracy of +/-5μm and repeated accuracy of +/-2μm.
  • Ultra-thin wafer processing with cutting widths as narrow as 35μm using a 40μm nozzle.
  • Clean processing with no environmental pollution, utilizing deionized water or inert liquids.
  • Automated processing reduces labor costs and increases efficiency.
  • Suitable for third-generation semiconductors like SiC/GaN, aerospace materials, and ceramic substrates.
  • High processing yield with surface roughness Ra≤1.6um and linear cutting speed ≥50mm/s.
  • Compact design with countertop volumes of 300*300*150mm or 400*400*200mm.
  • Versatile numerical control options including 3 axis, 3+1 axis, and 3+2 axis configurations.
Faqs:
  • What are the main advantages of microjet laser technology equipment?
    The advantages include high-precision processing, excellent cooling effects, no heat-affected zones, parallel cutting edges, and efficient performance, making it ideal for hard and brittle materials.
  • In what fields are microjet laser technology equipment used?
    It is widely used in third-generation semiconductors, aerospace materials, diamond cutting, metallized diamond, ceramic substrates, and other precision machining applications.
  • What is the processing capability of the microjet laser equipment?
    The equipment can achieve surface roughness Ra≤1.6um, opening speeds ≥1.25mm/s, circumference cutting ≥6mm/s, and linear cutting speeds ≥50mm/s, depending on material characteristics.
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