Wafer Thinning Equipment

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April 15, 2025
Video Description:
Discover the Wafer Thinning System Precision Thinning Equipment, compatible with 4-12inch SiC, Si, GaAs, and sapphire wafers. Achieve ±1 μm thickness control and ≤2 μm TTV for advanced packaging and power device fabrication. Optimized for wide-bandgap semiconductors like SiC.