Brief: Wondering how it compares to other options? See the demo and decide for yourself. In this video, we showcase the SiC Ceramic End Effector in action, demonstrating its precise wafer handling capabilities in high-temperature and corrosive semiconductor processing environments. You'll see how its high-purity SiC construction ensures reliability and low particle generation for cleanroom applications.
Related Product Features:
Made from high-purity Silicon Carbide (SiC) with a purity of ≥99% for superior performance.
Withstands extreme temperatures up to 1600°C, ideal for high-heat semiconductor processes.
Excellent resistance to acids, bases, and plasma environments, ensuring chemical stability.
High mechanical strength with a flexural strength greater than 400 MPa for durability.
Low particle generation design maintains cleanliness in Class 1-100 cleanrooms.
Customizable sizes available for 4-inch to 12-inch wafers with robotic arm compatibility.
Offers polished or matte surface finishes to meet specific user requirements.
Ensures dimensional accuracy and reliability in wafer transport, etching, and deposition.
Faqs:
What is the material used for the SiC Ceramic End Effector?
The SiC Ceramic End Effector is made from high-purity Silicon Carbide (SiC) with a purity of ≥99%, providing excellent thermal resistance, mechanical strength, and chemical stability for harsh semiconductor processing environments.
What applications are the SiC Ceramic End Effector suitable for?
It is ideal for wafer handling, semiconductor processing such as etching and deposition, robotic arm integration, and package testing and chip sorting, ensuring reliable performance in various manufacturing stages.
Is the SiC Ceramic End Effector compatible with cleanroom environments?
Yes, the SiC Ceramic End Effector is suitable for use in Class 1-100 cleanrooms, ensuring optimal cleanliness and compatibility with ultra-clean semiconductor manufacturing environments.