​​Double-Side Polished High-Purity SiC Mirror Optical Component for MEMS Micromirror

SiC substrate
September 25, 2025
Category Connection: SiC Substrate
Brief: Discover the Double-Side Polished High-Purity SiC Mirror Optical Component for MEMS Micromirror, a high-performance optical solution designed for precision and durability in extreme environments. Ideal for AR/MR glasses, semiconductor lithography, and high-end laser systems.
Related Product Features:
  • Ultra-lightweight and miniaturized design with compact dimensions (≤50mm) for space-sensitive applications.
  • Superior stability and environmental resistance with low thermal expansion and high elastic modulus.
  • Excellent thermal management with high thermal conductivity (120-200 W/m*K) for rapid heat dissipation.
  • Top-tier optical surface quality with nanoscale smoothness (Ra ≤0.5 nm) on both sides.
  • Outstanding durability and chemical inertness with high hardness (Mohs 9.5) and resistance to acids and alkalis.
  • Ideal for AR/MR glasses, semiconductor lithography, and high-end laser optical systems.
  • Operates reliably in extreme temperatures from -50°C to 500°C.
  • Precision machined using reaction sintering, CVD, or pressureless sintering for consistent quality.
Faqs:
  • How do SiC mirrors work in optics?
    SiC mirrors leverage silicon carbide's low thermal expansion, high thermal conductivity, and high stiffness to maintain nanoscale surface stability under extreme conditions, ensuring minimal distortion in high-precision optical systems.
  • How does a silicon carbide (SiC) mirror perform in extreme environments?
    SiC mirrors excel in extreme environments due to their low thermal expansion, high thermal stability, and chemical inertness, operating reliably from -60°C to 180°C and resisting vibration, impact, and corrosion.
  • What are the key applications of double-side polished SiC mirrors?
    Double-side polished SiC mirrors are used in AR/MR glasses, semiconductor lithography, high-end laser systems, and MEMS micromirrors, meeting stringent requirements for precision, stability, and miniaturization.