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Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine

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July 21, 2025
Category Connection: Semiconductor Equipment
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Brief: Discover the Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine, a cutting-edge solution for precision processing of hard and brittle materials like silicon, SiC, sapphire, and quartz. Ideal for semiconductor wafers, optical components, and special ceramics, this machine offers multi-wire parallel cutting, sub-micron accuracy, and dynamic oscillating cutting for superior performance.
Related Product Features:
  • Multi-wire parallel cutting with 1-3m/s operation speed for high efficiency.
  • Sub-micron accuracy (±0.01mm) ensures precision in every cut.
  • Descending feed mechanism minimizes chipping for cleaner cuts.
  • Dynamic oscillating cutting (±8°) optimizes surface roughness (Ra<0.5μm).
  • Supports batch processing of semiconductor wafers, optical components, and ceramics.
  • Compatible with silicon, silicon carbide (SiC), sapphire (Al₂O₃), and quartz.
  • Intelligent system with machine vision positioning (5μm accuracy) and adaptive tension control.
  • IoT remote monitoring and MES system integration for smart manufacturing.
Faqs:
  • What is the advantage of oscillating cutting in diamond wire saws?
    Oscillating cutting (±8°) reduces chipping to <15μm and improves surface finish (Ra<0.5μm) for brittle materials like SiC and sapphire.
  • How fast can multi-wire diamond saws cut silicon wafers?
    With 200+ wires at 1-3m/s, it cuts 300mm silicon wafers in <2 minutes, boosting productivity 5x vs single-wire saws.
  • What materials are compatible with this cutting machine?
    The machine supports silicon, silicon carbide (SiC), sapphire (Al₂O₃), quartz, and various ceramics, making it versatile for multiple industries.
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