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Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine

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July 21, 2025
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The diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine is a high-end system specifically designed for precision processing of hard and brittle materials. It integrates multiple advanced functions including multi-wire parallel cutting (1-3m/s operation speed), sub-micron accuracy (±0.01mm), descending feed mechanism, and dynamic oscillating cutting. The machine is suitable for batch processing of semiconductor wafers, optical components, and special ceramics, supporting various materials such as silicon, silicon carbide (SiC), sapphire (Al₂O₃), and quartz, meeting requirements from R&D to mass production.
Brief: Discover the Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine, a cutting-edge solution for precision processing of hard and brittle materials like silicon, SiC, sapphire, and quartz. Ideal for semiconductor wafers, optical components, and special ceramics, this machine offers multi-wire parallel cutting, sub-micron accuracy, and dynamic oscillating cutting for superior performance.
Related Product Features:
  • Multi-wire parallel cutting with 1-3m/s operation speed for high efficiency.
  • Sub-micron accuracy (±0.01mm) ensures precision in every cut.
  • Descending feed mechanism minimizes chipping for cleaner cuts.
  • Dynamic oscillating cutting (±8°) optimizes surface roughness (Ra<0.5μm).
  • Supports batch processing of semiconductor wafers, optical components, and ceramics.
  • Compatible with silicon, silicon carbide (SiC), sapphire (Al₂O₃), and quartz.
  • Intelligent system with machine vision positioning (5μm accuracy) and adaptive tension control.
  • IoT remote monitoring and MES system integration for smart manufacturing.
Faqs:
  • What is the advantage of oscillating cutting in diamond wire saws?
    Oscillating cutting (±8°) reduces chipping to <15μm and improves surface finish (Ra<0.5μm) for brittle materials like SiC and sapphire.
  • How fast can multi-wire diamond saws cut silicon wafers?
    With 200+ wires at 1-3m/s, it cuts 300mm silicon wafers in <2 minutes, boosting productivity 5x vs single-wire saws.
  • What materials are compatible with this cutting machine?
    The machine supports silicon, silicon carbide (SiC), sapphire (Al₂O₃), quartz, and various ceramics, making it versatile for multiple industries.
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